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IC资料

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IC封装资料_电容_GRM155R62A104KE14D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121621920.26 KB29页220
IC封装资料_电感_SRN1060-101M.pdf
Features■Semi-shieldedconstruction■Highinductance■Inductancerange:10to470µH■Highratedcurrent-upto5.4A■RoHScompliant*andhalog...
2024-12-121621316.17 KB3页164
IC封装资料_电容_0603B102M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216211.05 MB27页176
IC封装资料_电感_SWPA6040S680MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1216211.32 MB22页254
IC封装资料_电容_0201B104K100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216211.05 MB27页96
IC封装资料_三极管_DMP2130LDM-7.pdf
DMP2130LDMDocumentnumber:DS31118Rev.6-21of4www.diodes.comMay2008©DiodesIncorporatedDMP2130LDMNEWPRODUCTP-CHANNELENHANCEMENTMODEFI...
2024-12-121620276.96 KB4页19
IC封装资料_电感_SDFL1608LR12KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121620457.75 KB7页184
IC封装资料_电容_CL10A106KQ8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A106KQ8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-1216201.42 MB36页77
IC封装资料_机械式开关-按键_TL3301AF160RG.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1216201.21 MB2页159
IC封装资料_电容_CL10C390JB8NCNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121620316.3 KB3页270
IC封装资料_电感_NLCV32T-1R5M-PF.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121619249.79 KB16页97
IC封装资料_电容_GRM1885C1H7R5CA01D.pdf
GRM1885C1H7R5CA01_(0603,C0G:EIA,7.5pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121619944.11 KB30页137
IC封装资料_电源管理芯片_LT3791IFE-1_PBF.pdf
LT3791-1137911fbFormoreinformationwww.linear.com/LT3791-1TypicalapplicaTionFeaTuresDescripTion60V4-SwitchSynchronousBuck-BoostCont...
2024-12-121619389.26 KB26页57
IC封装资料_电容_GCM188R71E104KA57D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1216194.17 MB96页90
IC封装资料_电源管理芯片_PAM2861CBR.pdf
PAM2861Documentnumber:DSxxxxxRev.1-11of12www.diodes.comJuly2013©DiodesIncorporatedPAM2861AProductLineofDiodesIncorporated1ALEDDRI...
2024-12-121619428.49 KB12页199
IC封装资料_电容_0805X475K160NT--2Kpcs.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216191.05 MB27页188
IC封装资料_电容_EMK316BJ475KL-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121618653.27 KB26页188
IC封装资料_电容_GRM1885C1H6R0CA01D.pdf
GRM1885C1H6R0CA01_(0603,C0G:EIA,6pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121618944.1 KB30页48
IC封装资料_电感_SDCL1005C3N9STDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121618376.19 KB4页78
IC封装资料_电感_SWPA252012S100MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1216181.32 MB22页93

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