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IC资料

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IC封装资料_连接器_AFC11-S38ICA-00.pdf
浙江博众电气有限公司ZHEJIANGBOZHONGELECTRICCO.，LTD承认书SPECIFICATIONFORAPPROVAL客户Customer：产品名Project：规格型号PartNo：贵公...
2024-12-1216021.4 MB10页134
IC封装资料_电容_CL10C050CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121602259.58 KB3页39
IC封装资料_电容_1210B106K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216021.05 MB27页148
IC封装资料_电源管理芯片_SGM6600-ADJYN6GTR.pdf
SGM660090%EfficientSynchronousStep-UpConverterwith1.2ASwitchGENERALDESCRIPTIONTheSGM6600isa1.2MHz,constantfrequency,currentmode,sy...
2024-12-121601559.51 KB14页149
IC封装资料_电容_GRM188R71H472KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121601944.07 KB30页226
IC封装资料_电容_TAJA155K020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121601210.32 KB7页84
IC封装资料_电容_CC0603MRX5R5BB226.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1216011.22 MB13页239
IC封装资料_电源管理芯片_LM1117IMPX-5.0_NOPB.pdf
ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityReferenceDesignLM1117SNOS412N–FEBRUARY2000–REVISEDJANUAR...
2024-12-1216012.74 MB38页270
IC封装资料_电源管理芯片_LT1617ES5_TRPBF.pdf
1LT1617/LT1617-1TYPICALAPPLICATIONUAPPLICATIOSUDESCRIPTIOUFEATURESMicropowerInvertingDC/DCConvertersinSOT-23TheLT®1617/LT1617-1ar...
2024-12-121601226.25 KB8页263
IC封装资料_电容_GRM155R60J155ME80D.pdf
ChipMultilayerCeramicCapacitorsforGeneralPurposeGRM155R60J155ME80_(0402,X5R(EIA),1.5uF,DC6.3V)_:PackagingCodeReferenceSheet■Scope...
2024-12-121601899.99 KB30页136
IC封装资料_电容_0603B103K251NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216011.05 MB27页105
IC资料_HLS27DRR0850C (BANNER).pdf
DatasheetBanner'sHLS27HazardousLocationLEDStripLighthasasturdyaluminumhousingandisencasedinashatterproof,UV-stabilized,polycarbona...
2024-12-151601673.17 KB8页174
IC资料_HLS27DWB1130C (BANNER).pdf
DatasheetBanner'sHLS27HazardousLocationLEDStripLighthasasturdyaluminumhousingandisencasedinashatterproof,UV-stabilized,polycarbona...
2024-12-151601673.17 KB8页233
IC封装资料_电感_MLF1608DR22JT000.pdf
February2017INDUCTORSFebruary2017MultilayerFerriteMLF16081608[0603inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsMLF1608...
2024-12-121600311.11 KB11页194
IC封装资料_电源管理芯片_BQ24195RGER.pdf
VBUSPMIDOTGD+D–STATSDASCLINTCESWBTSTREGNPGNDSYSBATILIMTS1TS2+3.3VHostREGNREGNUSB3.9V–17Vbq24195LPhoneTabletBATTERYQ1CSD25302Q2C5...
2024-12-1216003.74 MB50页113
IC封装资料_电容_GRM1885C1H360GA01D.pdf
GRM1885C1H360GA01_(0603,C0G:EIA,36pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121600944.09 KB30页218
IC封装资料_电容_TMK105BJ104KV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121600857.12 KB55页76
IC封装资料_电容_GRM188R71H123KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121600944.07 KB30页186
IC封装资料_电容_CL03C0R5BA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-121600355.35 KB3页283
IC封装资料_电容_CL10A475KP8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A475KP8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1216001.42 MB36页280

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