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IC封装资料_电容_0805B225K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219531.05 MB27页66
IC封装资料_电阻_RC0603FR-0710KL.pdf
DATASHEETGENERALPURPOSECHIPRESISTORSRC_Lseries±0.1%,±0.5%,±1%,±5%Sizes0075/0100/0201/0402/0603/0805/1206/1210/1218/2010/2512Ro...
2024-12-1219531.06 MB10页229
IC封装资料_电感_YPRH104R-2R2M.pdf
SMDPowerInductors-YPRH104RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-121953762.21 KB4页164
IC封装资料_连接器_KF103-5.0-8P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121953205.01 KB1页182
IC封装资料_电容_CL10C6R8DC81PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121953452.9 KB21页18
IC封装资料_嵌入式微处理器_STC15F2K60S2-28I-LQFP44.pdf
STCMCULimitedSTC—8051单片机全球第一品牌，全球最大的8051单片机设计公司官方网站：www.STCMCU.comwww.GXWMCU.comSTC15F2K60S2系列单片机...
2024-12-12195320.18 MB1163页120
AB-33B5-6V-B (A-BRIGHT).pdf
AAA---BBBRRRIIIGGGHHHTTTA-BRIGHTINDUSTRIALCO.,LTD.A-BRIGHT10/30/20061MULTILAMPSLEDBULBDataSheetFeature:HighefficiencyLEDmaterialsa...
2024-12-111953186 KB3页82
IC封装资料_连接器_1715802.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12195236.13 MB445页79
IC封装资料_电容_CL10C681JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121952316.29 KB3页202
IC封装资料_电感_YNR4018-150M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121952661.38 KB5页92
IC封装资料_电容_GRM188R61H684KA75D.pdf
ChipMultilayerCeramicCapacitorsforGeneralPurposeGRM188R61H684KA75_(0603,X5R(EIA),0.68uF,DC50V)_:PackagingCodeReferenceSheet■Scope...
2024-12-121952898.62 KB30页263
IC封装资料_电容_TAJB225K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121952210.32 KB7页238
IC封装资料_电源管理芯片_LT3014HVEDD_TRPBF.pdf
LT301413014fdTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION20mA,3Vto80VLowDropoutMicropowerLinearRegulatorTheLT®3014isahighvol...
2024-12-121951266.84 KB16页199
IC封装资料_电感_NLV32T-R10J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-121951224.35 KB10页55
IC封装资料_电容_CL10F105ZP8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F105ZP8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121951360.23 KB3页107
IC封装资料_电容_CL10C6R8DB81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121951259.58 KB3页62
IC封装资料_电感_NLV32T-100J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121950325.01 KB6页153
IC封装资料_电容_0603CG102J101NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219501.05 MB27页22
IC封装资料_电源管理芯片_LT3741EUF_PBF.pdf
LT3741/LT3741-1137411fgFormoreinformationwww.linear.com/LT3741TYPICALAPPLICATIONDESCRIPTIONHighPower,ConstantCurrent,ConstantVolta...
2024-12-121950714.49 KB24页120
IC封装资料_电感_SWPA5020S6R8MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1219501.32 MB22页56

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