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IC封装资料_电容_TAJD335K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121500208.62 KB7页169
IC封装资料_电源管理芯片_TP4067-4_2V.pdf
南京拓品微电子有限公司NanJingTopPowerASICCorp.REV_1.11TP4067南京拓品微电子有限公司NanJingTopPowerASICCorp.数据手册DATASHEETTP4067(...
2024-12-121500838.13 KB14页181
IC封装资料_电感_YP0403-220M.pdf
SMDPowerInductors-YP0403Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121500776.45 KB5页8
IC封装资料_电容_GRM31C5C1H104JA01L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12149910.43 MB296页238
IC封装资料_电容_UCD1V101MCL6GS.pdf
UUUUSpecificationsItemPerformanceCharacteristicsCategoryTemperatureRangeRatedVoltageRangeRatedCapacitanceRangeCapacitanceTolerance...
2024-12-121499812.05 KB2页266
IC封装资料_电容_CL10B683KO8NFNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121499452.9 KB21页178
IC封装资料_电容_CL10B683KB85PNC.pdf
Supplier:Samsungelectro-mechanicsSamsungP/N:CL10B683KB85PNCProduct:Multi-layerCeramicCapacitorDescription:CAP,68㎋,50V,±1...
2024-12-121499228.45 KB2页170
IC封装资料_电源管理芯片_LTC3853EUJ_PBF.pdf
LTC385313853fcFormoreinformationwww.linear.com/LTC3853TYPICALAPPLICATIONFEATURESDESCRIPTIONTripleOutput,MultiphaseSynchronousStep-...
2024-12-121499833.71 KB36页85
IC封装资料_电源管理芯片_B1212S-2W.pdf
YUANB系列DC-DC非稳压单输出CONVERTERSIP4脚封装BxxxxS-xW1KVDC隔离0.1W～1W输入电压5V/9V/12V/15V/24VDC输出电压3.3V/5V/9V/12V/15V/24VDC...
2024-12-121499635.73 KB4页26
IC封装资料_电容_1206F683M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214981.05 MB27页84
IC封装资料_电感_NLV32T-022J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-121498224.35 KB10页140
IC封装资料_电容_0603B225K100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214981.05 MB27页144
IC封装资料_电感_SDFL2012T220KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121497457.75 KB7页104
IC封装资料_电容_CL05B472KA5NNNC.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12149717.81 MB176页7
IC封装资料_电容_0402N1R8C500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214971.26 MB20页292
IC封装资料_电容_TAJE157K010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121497210.32 KB7页6
IC封装资料_电容_EGS2GM3R3F12OT.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12149715.39 MB230页220
IC封装资料_三极管_IXTP1N120P.pdf
©2007IXYSCORPORATION,AllrightsreservedSymbolTestConditionsMaximumRatingsVDSSTJ=25°Cto150°C1200VVDGRTJ=25°Cto150°C,RGS=1MΩ120...
2024-12-121496227.43 KB4页241
IC封装资料_电容_CL10B272KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121495259.57 KB3页254
IC封装资料_电源管理芯片_ME6119A30PG.pdf
V06www.microne.com.cnPage1of10ME6119400mA带载、18V耐压、低压差快速响应LDO概述ME6119是一款高精度、低噪声、低压差、保护功能齐全的的L...
2024-12-121495473.67 KB10页103

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