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IC资料

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IC封装资料_电源管理芯片_78L05-1.pdf
Page:P2-P1Plastic-EncapsulateVoltageRegulatorFEATURESABSOLUTEMAXIMUMRATINGS(Operatingtemperaturerangeapplies)ParameterSymbolValueU...
2024-12-121457355.46 KB2页241
IC封装资料_电容_CC0402BRNPO9BN1R8.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121457998.46 KB11页244
IC封装资料_电感_MLP2016SR47MT0S1.pdf
INDUCTORSMarch2015��MLP20162016[0806inch]**��JIS[EIA]��MLP2016�MLP��更多资料下载请到五八文库w...
2024-12-121457334.71 KB13页169
IC封装资料_电容_GRM1555C1H330FA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121456920.26 KB29页185
IC封装资料_电容_0603F225Z160CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214561.26 MB20页160
IC封装资料_三极管_SSM3J328R_LF.pdf
SSM3J328R2014-03-011TOSHIBAField-EffectTransistorSiliconP-ChannelMOSType(U-MOSⅥ)SSM3J328R○PowerManagementSwitchApplications•1.5...
2024-12-121456318.26 KB6页158
IC封装资料_三极管_NTK3134NT1G.pdf
©SemiconductorComponentsIndustries,LLC,2014May,2019−Rev.41PublicationOrderNumber:NTK3134N/DNTK3134NMOSFET–Power,Single,N-Channe...
2024-12-121456198.49 KB5页30
IC封装资料_电感_YPRH104R-100M.pdf
SMDPowerInductors-YPRH104RSeries深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●U...
2024-12-121456762.21 KB4页145
IC封装资料_电容_GRM1885C2A360JA01D.pdf
GRM1885C2A360JA01_(0603,C0G:EIA,36pF,DC100V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121456943.97 KB30页185
IC封装资料_数据转换器_AD5628ARUZ-2.pdf
Octal,12-/14-/16-Bit,SPIVoltageOutputdenseDACwith5ppm/°C,On-ChipReferenceDataSheetAD5628/AD5648/AD5668Rev.JDocumentFeedbackInform...
2024-12-1214551.04 MB30页292
IC封装资料_电感_YSPI0740-2R2M.pdf
SMDPowerInductors-YSPI0740Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121455696.56 KB4页211
IC封装资料_电容_1206B821K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214551.05 MB27页68
IC封装资料_连接器_1903815-1.pdf
A3DIMENSIONS:0PLC1PLC2PLC3PLC4PLCANGLESDDCBACBA4321OFSCALESHEETREVNAMESIZECAGECODEDRAWINGNOTOLERANCESUNLESSOTHERWISESPECIFIED:DWNC...
2024-12-121455295.8 KB1页43
IC封装资料_电容_0402B103K160CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214551.26 MB20页287
IC封装资料_电容_UWT1V470MCL1GS.pdf
114ALUMINUMELECTROLYTICCAPACITORSU1W2T314C5160708M9C10L11112G13B14ConfigurationPackagecodeSizecodeCapacitancetolerance(±20%)Rated...
2024-12-121455769.15 KB2页158
IC封装资料_电容_GRM1885C1H121JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121455944.07 KB30页215
IC封装资料_电容_CL10C361JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121455316.29 KB3页239
IC封装资料_电容_0603X106M6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214551.05 MB27页53
IC封装资料_电源管理芯片_LM2576HVS-ADJ_TR.pdf
LM2576SeriesSIMPLESWITCHER3AStep-DownVoltageRegulatorGeneralDescriptionTheLM2576seriesofregulatorsaremonolithicintegratedcircuitst...
2024-12-1214553.52 MB14页130
IC封装资料_电容_CL10C390JB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C390JB81PNC●Product:Multi-layerCeramicCapacitorCAP,39㎊,50V,±5%,C0G,0603●AEC-Q200Qualifi...
2024-12-1214545.8 MB36页13

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