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IC封装资料_电容_0603B331K101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214221.26 MB20页211
IC封装资料_电容_CL10A224KP8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A224KP8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1214211.42 MB36页13
IC封装资料_电感_SWPA3015S150MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1214211.32 MB22页98
IC封装资料_电容_GRM188R71A124KA01D.pdf
GRM188R71A124KA01_(0603,X7R:EIA,0.12uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121421962.4 KB30页93
IC封装资料_微控制器_XM003Q.pdf
XM003（文件编号：S&CIC1807）深圳市富满电子集团股份有限公司SHENZHENFINEMADEELECTRONICSGROUPCO.,LTD.八位单片机www.superchip.cn第1页...
2024-12-1214201.41 MB33页243
IC封装资料_电容_TAJV337M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121420210.31 KB7页295
IC封装资料_电容_TAJD107M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121420210.32 KB7页196
IC封装资料_连接器_DF12B_3.0_-40DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121420288.67 KB11页187
IC封装资料_电容_GRM1555C1HR40BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121420920.26 KB29页153
IC封装资料_电容_CL10B104JO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104JO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121420361.09 KB3页280
IC封装资料_电源管理芯片_LTC4367IDD_PBF.pdf
LTC436714367fbFormoreinformationwww.linear.com/LTC4367TYPICALAPPLICATIONFEATURESDESCRIPTION100VOvervoltage,UndervoltageandReverseS...
2024-12-121419936.56 KB22页160
IC封装资料_过流保护_RL16-200.pdf
PositiveThermalCoefficient(PTC)RL16SeriesSpecificationsaresubjecttochangewithoutnotice.Pleaserefertohttp://www.ruilon.com.cnforcur...
2024-12-121419328.49 KB4页74
IC封装资料_电容_CL03C1R2CA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-1214191.4 MB36页130
IC封装资料_电源管理芯片_LTC3413EFE_TRPBF.pdf
LTC341313413fcTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION3A,2MHzMonolithicSynchronousRegulatorforDDR/QDRMemoryTerminationThe...
2024-12-121419339.57 KB16页69
IC封装资料_电源管理芯片_LTC2953CDD-1_PBF.pdf
LTC295312953fTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONPushButtonOn/OffControllerwithVoltageMonitoringTheLTC®2953isapushbu...
2024-12-121418292.4 KB20页30
IC封装资料_三极管_FMD5N50E5.pdf
FMD5N50E5Rev1.0-1-VDSS500VID5ATrr85nsRDS(ON)Typ1.25ΩGeneralDescription：FMD5N50E5,thesiliconN-channelEnhancedVDMOSFETs,isobtained...
2024-12-121418827.69 KB10页285
IC封装资料_三极管_WSD30L60DN56.pdf
DFN5X6A-8_EPProductSummeryWSD30L60DN56Page1www.winsok.twDec.2014P-ChMOSFETFeaturesApplications•-30V/-45A,RDS(ON)=12mΩ(max.)@VGS=...
2024-12-121417673.5 KB9页72
IC封装资料_电源管理芯片_TOP222PN.pdf
Figure1.TypicalFlybackApplication.reducescostinlowerpower,highefficiencyapplications.Theinternalleadframeofthispackageusessixofits...
2024-12-1214171.67 MB20页141
IC封装资料_电源管理芯片_TL431AFDT8R.pdf
ImportantnoticeDearCustomer,On7February2017theformerNXPStandardProductbusinessbecameanewcompanywiththetradenameNexperia.Nexperiais...
2024-12-121417278.43 KB28页30
IC封装资料_连接器_DF12B-40DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121417288.67 KB11页70

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