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IC资料

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IC封装资料_电容_CL10A224KP8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A224KP8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1214201.42 MB36页13
IC封装资料_电感_SWPA3012S100MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1214201.32 MB22页224
IC封装资料_电容_TAJV337M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121420210.31 KB7页295
IC封装资料_连接器_DF12B_3.0_-40DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121420288.67 KB11页187
IC封装资料_电容_GRM188R71A124KA01D.pdf
GRM188R71A124KA01_(0603,X7R:EIA,0.12uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121420962.4 KB30页93
IC封装资料_微控制器_XM003Q.pdf
XM003（文件编号：S&CIC1807）深圳市富满电子集团股份有限公司SHENZHENFINEMADEELECTRONICSGROUPCO.,LTD.八位单片机www.superchip.cn第1页...
2024-12-1214191.41 MB33页243
IC封装资料_电容_TAJD107M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121419210.32 KB7页196
IC封装资料_电容_GRM1555C1HR40BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121419920.26 KB29页153
IC封装资料_电容_CL10B104JO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B104JO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121419361.09 KB3页280
IC封装资料_过流保护_RL16-200.pdf
PositiveThermalCoefficient(PTC)RL16SeriesSpecificationsaresubjecttochangewithoutnotice.Pleaserefertohttp://www.ruilon.com.cnforcur...
2024-12-121419328.49 KB4页74
IC封装资料_电感_SWPA3015S150MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1214191.32 MB22页98
IC封装资料_电源管理芯片_LTC3413EFE_TRPBF.pdf
LTC341313413fcTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION3A,2MHzMonolithicSynchronousRegulatorforDDR/QDRMemoryTerminationThe...
2024-12-121419339.57 KB16页69
IC封装资料_电容_CL03C1R2CA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-1214181.4 MB36页130
IC封装资料_电源管理芯片_LTC4367IDD_PBF.pdf
LTC436714367fbFormoreinformationwww.linear.com/LTC4367TYPICALAPPLICATIONFEATURESDESCRIPTION100VOvervoltage,UndervoltageandReverseS...
2024-12-121417936.56 KB22页160
IC封装资料_三极管_WSD30L60DN56.pdf
DFN5X6A-8_EPProductSummeryWSD30L60DN56Page1www.winsok.twDec.2014P-ChMOSFETFeaturesApplications•-30V/-45A,RDS(ON)=12mΩ(max.)@VGS=...
2024-12-121417673.5 KB9页72
IC封装资料_三极管_FMD5N50E5.pdf
FMD5N50E5Rev1.0-1-VDSS500VID5ATrr85nsRDS(ON)Typ1.25ΩGeneralDescription：FMD5N50E5,thesiliconN-channelEnhancedVDMOSFETs,isobtained...
2024-12-121417827.69 KB10页285
IC封装资料_电容_TAJB335K025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121416210.32 KB7页229
IC封装资料_电感_YPRH0704-331M.pdf
SMDPowerInductors-YPRH0704Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●H...
2024-12-121416730.34 KB5页151
IC封装资料_连接器_DF12B-40DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121416288.67 KB11页70
IC封装资料_连接器_A2001WV-S-3P.pdf
A2001SERIESCHANGJIANGCONNECTORSTEL:+86-755-2995911929959129FAX:+86-755-29959139Http://www.CJT.cn2.00mmpitchwiretoboardconnectorSpe...
2024-12-121416404 KB6页228

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