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IC资料

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IC封装资料_电容_0603X105K160CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214001.26 MB20页146
IC封装资料_电容_TAJD685K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121400210.32 KB7页51
IC封装资料_电容_CL10B391KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121400259.57 KB3页218
IC封装资料_电容_CL10B104KA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121400259.58 KB3页85
IC封装资料_电感_SDFL1608LR22KTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/11/15SunlordIndustrialPark,Dafuyu...
2024-12-121400457.75 KB7页57
IC封装资料_电感_MLK1005SR22JT000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-121400209.31 KB10页99
IC封装资料_电容_0402X153K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214001.05 MB27页89
IC封装资料_电感_MCL2012S2R2MT.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/04/15SunlordIndustrialPark,Dafuyu...
2024-12-121400275.63 KB3页172
IC封装资料_电容_CC0603JRNPO0BN331.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1213991.22 MB13页62
IC封装资料_连接器_1717732.pdf
https://www.phoenixcontact.com/us/produkte/171773219.10.2012Page1/5PCBterminalblock-GMKDS1,5/3-7,62-1717732Pleasebeinformedthatthe...
2024-12-121399170.65 KB5页270
IC封装资料_电源管理芯片_ADR3425ARJZ-R7.pdf
ADR3412/ADR3420/ADR3425/ADR3430/ADR3433/ADR3440/ADR3450Rev.BInformationfurnishedbyAnalogDevicesisbelievedtobeaccurateandreliable.H...
2024-12-1213991.02 MB24页89
IC封装资料_电容_CL10C5R1CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121399259.58 KB3页42
IC封装资料_电容_GJM1555C1H1R1BB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12139910.43 MB296页271
IC封装资料_电容_CC0603KRX5R8BB474.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1213981.22 MB13页222
IC封装资料_三极管_DMG2305UX-7.pdf
DMG2305UXDocumentnumber:DS36196Rev.7-21of6www.diodes.comSeptember2018©DiodesIncorporatedDMG2305UXP-CHANNELENHANCEMENTMODEMOSFETPr...
2024-12-121398516.35 KB6页202
IC封装资料_电容_CL10C6R2CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121398259.58 KB3页20
IC封装资料_连接器_DF12B_3.0_-30DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121398288.67 KB11页192
IC封装资料_电容_CL10C151JB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C151JB81PNC●Product:Multi-layerCeramicCapacitorCAP,150㎊,50V,±5%,C0G,0603●AEC-Q200Qualif...
2024-12-1213975.8 MB36页144
IC封装资料_电容_TAJC476K010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121397210.32 KB7页253
IC封装资料_电源管理芯片_TOP222PN.pdf
Figure1.TypicalFlybackApplication.reducescostinlowerpower,highefficiencyapplications.Theinternalleadframeofthispackageusessixofits...
2024-12-1213971.67 MB20页141

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