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IC资料

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IC封装资料_电容_TAJC335K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121221210.32 KB7页196
IC封装资料_电容_0402CG910J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212211.05 MB27页248
IC封装资料_电容_CL10A106MQ8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A106MQ8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-1212201.28 MB36页76
IC封装资料_电源管理芯片_LTC3106EFE_TRPBF.pdf
LTC310613106fFormoreinformationwww.linear.com/LTC3106TypicalapplicaTionFeaTuresDescripTion300mALowVoltageBuck-BoostConverterwithPo...
2024-12-1212201.79 MB38页21
IC封装资料_三极管_DMG3415U-7.pdf
DMG3415UDocumentnumber:DS31735Rev.13-31of7www.diodes.comMarch2018©DiodesIncorporatedDMG3415UP-CHANNELENHANCEMENTMODEMOSFETProduct...
2024-12-121220698.76 KB7页57
IC封装资料_电容_GCJ219R72A333KA01D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1212204.17 MB96页170
IC封装资料_连接器_AFC01-S44H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-1212191.58 MB1页257
IC封装资料_电容_CC1206KKX7RBBB221.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1212191.22 MB13页208
IC资料_Q45UR3BA63CQ6KQ (BANNER).pdf
DatasheetPiezoelectricProximityModeSensorswithPush-ButtonorRemoteProgrammingofSensingWindows•Ultrasonicproximitydetectionfrom50mm...
2024-12-151219440.17 KB10页40
IC封装资料_三极管_BSS138K.pdf
TolearnmoreaboutONSemiconductor,pleasevisitourwebsiteatwww.onsemi.comPleasenote:AspartoftheFairchildSemiconductorintegration,someo...
2024-12-121218362.23 KB8页257
IC封装资料_电容_GMK105BJ104KV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-121218857.12 KB55页32
IC封装资料_连接器_1829219.pdf
https://www.phoenixcontact.com/pi/products/182921904/09/2019Page1/4Feed-throughheader-GMSTBV2,5/8-GF-7,62-1829219Pleasebeinformedt...
2024-12-121217190.55 KB4页124
IC封装资料_电容_0603CG820J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1212171.05 MB27页64
IC封装资料_电源管理芯片_LT3060EDC-5_TRMPBF.pdf
LT3060Series13060fcFormoreinformationwww.linear.com/LT3060TypicalapplicaTionDescripTion45VVIN,Micropower,LowNoise,100mALowDropout,...
2024-12-121217515.79 KB26页172
IC封装资料_电源管理芯片_LT3021ES8-1.2_PBF.pdf
LT3021/LT3021-1.2/LT3021-1.5/LT3021-1.813021fcTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION500mA,LowVoltage,VeryLowDropoutLine...
2024-12-121217272.6 KB16页198
IC封装资料_三极管_WSD30140DN56.pdf
SymbolParameterRatingUnitsVDSDrain-SourceVoltage30VVGSGate-SourceVoltage±20VID@TC=25℃ContinuousDrainCurrent,VGS@10V1,785AID@TC=7...
2024-12-121217947.31 KB6页66
IC封装资料_电源管理芯片_TPS62160DGKR.pdf
22uF1.8V/1A10uF2.2µHTPS62161VINENAGNDPGNDSWVOSPGFB100k(3..17)VProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&Commun...
2024-12-1212173.1 MB40页71
IC封装资料_电容_TAJD108M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121217210.32 KB7页279
IC封装资料_电容_CL10B473KO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B473KO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121217361.27 KB3页175
IC封装资料_连接器_BM28B0.6-58DS2-0.35V_51_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121217562.52 KB8页276

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