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IC资料

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IC封装资料_电容_CL10C101JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121205340.15 KB3页270
IC封装资料_电容_GRM188R70J104KA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121205944.07 KB30页68
IC封装资料_电容_GRM1885C1H751JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121205944.07 KB30页188
IC封装资料_电容_CC0402CRNPO9BNR80.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121205998.46 KB11页290
IC封装资料_电容_CL10A475KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121205259.58 KB3页113
IC封装资料_电容_CL03A225MQ3CRNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL03A225MQ3CRNC·Product:Multi-layerCeramicCapacitor...
2024-12-1212051.42 MB36页203
IC封装资料_电源管理芯片_LTC3603EUF_TRPBF.pdf
LTC360313603fcFormoreinformationwww.linear.com/LTC3603FeaturesapplicationsDescription2.5A,15VMonolithicSynchronousStep-DownRegulat...
2024-12-121205367.24 KB22页146
IC封装资料_电感_MLG1005S3N6BT000.pdf
INDUCTORSMay2016��MLG1005S1005[0402inch]**��JIS[EIA]��MLG1005S�MLG��更多资料下载请到五八文库wk....
2024-12-121205420.58 KB16页57
IC封装资料_电源管理芯片_LTC4007EGN_PBF.pdf
LTC40071RevDFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONDESCRIPTION4A,HighEfficiency,StandaloneLi-IonBattery...
2024-12-121204338.05 KB24页28
IC封装资料_电容_CL10C301JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121204259.58 KB3页265
IC封装资料_电源管理芯片_LTC3025EDC-1_TRPBF.pdf
LTC3025-1/LTC3025-2/LTC3025-3/LTC3025-4130251234ffTypicalapplicaTionFeaTuresapplicaTionsDescripTion500mAMicropowerVLDOLinearRegula...
2024-12-121204333.78 KB14页43
IC封装资料_电容_CC1206KKX7RCBB682.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1212041.22 MB13页292
IC封装资料_电感_NLV32T-8R2J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121204325 KB6页136
IC封装资料_电源管理芯片_LM2576S-12_TR.pdf
LM2576SeriesSIMPLESWITCHER3AStep-DownVoltageRegulatorGeneralDescriptionTheLM2576seriesofregulatorsaremonolithicintegratedcircuitst...
2024-12-1212044.34 MB14页127
IC封装资料_电容_TMCMB0J227MTRF.pdf
293Dwww.vishay.comVishaySpragueRevision:07-Feb-20191DocumentNumber:40002Fortechnicalquestions,contact:tantalum@vishay.comTHISDOCUM...
2024-12-121204568.22 KB24页19
IC封装资料_电感_YSPI0740-100M.pdf
SMDPowerInductors-YSPI0740Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121204696.56 KB4页223
IC封装资料_连接器_1766136.pdf
https://www.phoenixcontact.com/us/products/176613610/24/2014Page1/5Basestrip-GMSTB2,5/3-G-7,62-1766136Pleasebeinformedthatthedatas...
2024-12-121204169.07 KB5页14
IC封装资料_电容_GCM21BR71C105KA58L.pdf
GCM21BR71C105KA58_(0805,X7R:EIA,1uF,DC16V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121203948.27 KB29页205
IC封装资料_电源管理芯片_TP4067-37.pdf
南京拓品微电子有限公司NanJingTopPowerASICCorp.REV_1.11TP4067南京拓品微电子有限公司NanJingTopPowerASICCorp.数据手册DATASHEETTP4067(...
2024-12-121203838.13 KB14页290
IC封装资料_电容_TAJA105M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121203210.32 KB7页200

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