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IC资料

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IC封装资料_连接器_DF12B_4.0_-20DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121125288.67 KB11页220
IC封装资料_电容_0805F105M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211251.05 MB27页100
IC封装资料_电源管理芯片_AP3032KTR-G1.pdf
DataSheetWHITELEDSTEP-UPCONVERTERAP3032Dec.2012Rev.1.2BCDSemiconductorManufacturingLimited1GeneralDescriptionTheAP3032isaninductor...
2024-12-121125565.41 KB13页48
IC封装资料_电感_IHLP2525CZER220M11.pdf
IHLP-2525CZ-11www.vishay.comVishayDaleRevision:12-Oct-171DocumentNumber:34190Fortechnicalquestions,contact:magnetics@vishay.comTHI...
2024-12-121125232.99 KB3页65
IC封装资料_连接器_1729076.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/6http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogMKDSN1,5/8OrderNo.:1729076The...
2024-12-121124243.66 KB6页156
IC封装资料_电容_GRM1885C1H9R1DA01D.pdf
GRM1885C1H9R1DA01_(0603,C0G:EIA,9.1pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121124944.12 KB30页5
IC封装资料_电源管理芯片_SPX3819M5-L-1-2_TR.pdf
SPX3819500mALow-NoiseLDOVoltageRegulatorJuly2018Rev.2.0.41/13Rev.2.0.4GENERALDESCRIPTIONTheSPX3819isapositivevoltageregulatorwitha...
2024-12-1211241.15 MB13页179
IC封装资料_电容_CL21X226MQQNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21X226MQQNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1211241.48 MB36页43
IC封装资料_电容_CL10B471KB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B471KB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121123361.35 KB3页18
IC封装资料_电源管理芯片_MP2315GJ-Z.pdf
MP2315HighEfficiency3A,24V,500kHzSynchronousStepDownConverterMP2315Rev.1.01www.MonolithicPower.com11/8/2014MPSProprietaryInformati...
2024-12-121123744.34 KB18页94
IC封装资料_电容_0603B512K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211231.05 MB27页24
IC封装资料_电容_CC0402CRNPO9BN2R2.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12112217.81 MB176页258
IC封装资料_电源管理芯片_LT1761ES5-5_TRPBF.pdf
LT1761Series11761sffTYPICALAPPLICATIONDESCRIPTION100mA,LowNoise,LDOMicropowerRegulatorsinTSOT-23TheLT®1761seriesaremicropower,low...
2024-12-1211221.21 MB22页68
IC封装资料_电容_0402B122K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1211221.26 MB20页151
IC封装资料_电容_0402B102M500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1211221.26 MB20页271
IC封装资料_电感_YSPI0420-6R8M.pdf
SMDPowerInductors-YSPI0420Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121122700.01 KB4页80
IC封装资料_连接器_DF12D_4.0_-30DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121122288.67 KB11页58
IC封装资料_连接器_A2541HWV-8P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121122814.66 KB16页298
IC封装资料_电容_GRM1555C1H3R9BA01D.pdf
GRM1555C1H3R9BA01_(0402,C0G:EIA,3.9pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121121944.3 KB30页257
IC封装资料_电容_1210X106M250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1211211.05 MB27页114

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