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IC封装资料_电容_CL10C3R3CB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121090316.22 KB3页38
IC封装资料_连接器_AFC01-S39FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1210901.85 MB10页12
IC封装资料_电容_CL10B222KC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121090259.58 KB3页279
IC封装资料_连接器_1935200.pdf
https://www.phoenixcontact.com/us/products/193520008/04/2015Page1/6PCBterminalblock-PT1,5/6-5,0-H-1935200Pleasebeinformedthattheda...
2024-12-121090172.21 KB6页150
IC封装资料_电容_0201X105M6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210891.05 MB27页90
IC封装资料_电容_0603CG0R2C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210891.05 MB27页13
IC封装资料_过压保护_TVS1801DRBR.pdf
VoltageTime(�s)TraditionalTVSTIFlat-Clamp201030ProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTN...
2024-12-1210881.2 MB21页169
IC封装资料_电源管理芯片_LTC4002EDD-8.4_TRPBF.pdf
LTC400214002f,LTCandLTareregisteredtrademarksofLinearTechnologyCorporation.Allothertrademarksarethepropertyoftheirrespectiveowners...
2024-12-121088253.54 KB16页17
IC封装资料_电感_SDCL1005CR27JTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121088376.19 KB4页123
IC封装资料_三极管_CS9N20A4R.pdf
CS9N20A4RWUXICHINARESOURCESHUAJINGMICROELECTRONICSCO.,LTD.Page1of102018V01○RSiliconN-ChannelPowerMOSFETGeneralDescription：CS9N20...
2024-12-121088489.89 KB10页67
IC封装资料_电容_CL10C010BB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121088339.99 KB3页89
IC封装资料_电容_CL31B106KOHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31B106KOHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1210881.45 MB36页184
IC封装资料_电容_GRM155R71H331KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121088920.26 KB29页26
IC封装资料_电容_0402N560J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210881.26 MB20页274
IC封装资料_三极管_IRF740STRLPBF.pdf
DocumentNumber:91055www.vishay.comS11-1049-Rev.C,30-May-111Thisdocumentissubjecttochangewithoutnotice.THEPRODUCTSDESCRIBEDHEREINAN...
2024-12-121087262 KB9页83
IC封装资料_三极管_PDTC114ET_215.pdf
1.Productprofile1.1GeneraldescriptionNPNResistor-EquippedTransistor(RET)familyinsmallSurface-MountedDevice(SMD)plasticpackages.1.2...
2024-12-1210861.37 MB17页144
IC封装资料_连接器_KF2EDGR-Y-3.81-10P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121086192.45 KB1页37
IC封装资料_电容_CL10B224KO8VPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121086259.58 KB3页149
IC封装资料_电容_CL10B154KA8VPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B154KA8VPNC●Product:Multi-layerCeramicCapacitorCAP,150㎋,25V,±10%,X7R,0603●AEC-Q200Quali...
2024-12-1210865.82 MB36页300
IC封装资料_电容_GRM1555C1H470JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121086920.26 KB29页299

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