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IC资料

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IC封装资料_三极管_NX3008CBKS_115.pdf
1.Productprofile1.1GeneraldescriptionComplementaryN/P-channelenhancementmodeField-EffectTransistor(FET)inverysmallSOT363(SC-88)Sur...
2024-12-1210802.36 MB21页80
IC封装资料_连接器_F0502-B-24-20T.pdf
FPC0.50mmConnectorsF0502-B-XX-20T≥24D更多资料下载请到五八文库wk.58sms.com
2024-12-121080290.85 KB1页38
IC封装资料_连接器_1-1827581-2.pdf
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2024-12-121080173.11 KB2页173
IC封装资料_电源管理芯片_LTC1871EMS_PBF.pdf
LTC187111871feTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONWideInputRange,NoRSENSE™CurrentModeBoost,FlybackandSEPICController...
2024-12-121080602.47 KB36页63
IC封装资料_电源管理芯片_LT1129CST-3.3_PBF.pdf
LT1129/LT1129-3.3/LT1129-51112935ffTYPICALAPPLICATIONDESCRIPTIONMicropowerLowDropoutRegulatorswithShutdownTheLT®1129/LT1129-3.3/L...
2024-12-121080259.63 KB16页29
IC封装资料_电感_NLV25T-680J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV25-PF2520[1008inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV25-PFTypeNLV-PFSeries...
2024-12-121079215.06 KB9页149
IC封装资料_连接器_DF3A-14P-2DSA.pdf
May.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-121079222.32 KB1页234
IC封装资料_电容_CL21C270JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210791.45 MB36页73
IC封装资料_电感_LQP03TN47NH02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-121079281.03 KB12页239
IC封装资料_电容_0201CG390J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210781.05 MB27页219
IC封装资料_电源管理芯片_78M12.pdf
Page:P1-P1Plastic-EncapsulateVoltageRegulatorFEATURESABSOLUTEMAXIMUMRATINGS(Operatingtemperaturerangeapplies)ParameterSymbolValueU...
2024-12-121078833.4 KB1页133
IC封装资料_电容_UWT1H221MNL1GS.pdf
114ALUMINUMELECTROLYTICCAPACITORSU1W2T314C5160708M9C10L11112G13B14ConfigurationPackagecodeSizecodeCapacitancetolerance(±20%)Rated...
2024-12-121078769.15 KB2页218
IC封装资料_电容_GRM1885C1H130JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121078944.07 KB30页227
IC封装资料_电容_0805CG681J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210781.05 MB27页227
IC封装资料_连接器_1758131.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12107836.13 MB445页281
IC封装资料_电容_T491A226K006AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-1210781.54 MB23页42
IC封装资料_连接器_1759156.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12107836.13 MB445页288
IC封装资料_连接器_KF2EDGRM-Y-3.5-13P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121077637.56 KB1页18
IC封装资料_电源管理芯片_TLV70218DBVR.pdf
TLV702xxGNDENINOUTVINVOUTOnOffCINCOUT1FCeramic�ProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTN...
2024-12-1210771.28 MB34页19
IC封装资料_连接器_DF12E_3.0_-40DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121077288.67 KB11页56

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