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IC封装资料_三极管_IRF8788TRPBF.pdf
www.irf.com18/18/08IRF8788PbFHEXFET��PowerMOSFETNotes��through�areonpage9Benefits�VeryLowGateCharge�VeryLowRDS(on)at4.5VVGS...
2024-12-121026316.19 KB9页11
IC封装资料_电容_TAJD477M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121026210.32 KB7页143
IC封装资料_连接器_DF13E-10DP-1.25V.pdf
HRSDRAWINGFORREFERENCEMay.1.2018Copyright2018HIROSEELECTRICCO.,LTD.AllRightsReserved.更多资料下载请到五八文库wk.58sms.comHRSDRAWIN...
2024-12-121026264.15 KB2页279
IC封装资料_电源管理芯片_LTC3407AEDD_TRPBF.pdf
LTC3407A13407afaTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONDualSynchronous600mA,1.5MHzStep-DownDC/DCRegulatorTheLTC®3407Ais...
2024-12-121026371.74 KB16页199
IC封装资料_电容_CC0805JRX7R9BB223.pdf
ProductSpecification–June16,2017V.18DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSGeneralPurpose&HighCapacitanceClass2,X7R6.3V...
2024-12-1210261.61 MB20页242
IC封装资料_电感_SWPA5040S151MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1210251.32 MB22页161
IC封装资料_电容_0603F474M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210251.05 MB27页213
IC封装资料_电感_MLK1005S27NJT000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-121025209.31 KB10页36
IC封装资料_电感_MLK1005S3N3ST000.pdf
INDUCTORSFebruary2015MultilayerCeramicMLK10051005[0402inch]**DimensionsCodeJIS[EIA]InductorsforHighFrequencyCircuitsMLK1005TypeMLK...
2024-12-121025209.31 KB10页84
IC封装资料_连接器_1755545.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogMSTBVA2,5/5-GOrderNo.:1755545...
2024-12-121025230.54 KB5页113
IC封装资料_电容_GCM188R71H152KA37D.pdf
Lsize1.6±0.1mmWsize0.8±0.1mmTsize0.8±0.1mmExternalterminalwidthe0.2to0.5mmDistancebetweenexternalterminalsg0.5mmmin.Sizecodeini...
2024-12-1210253.23 MB2页63
IC封装资料_电容_GRM1885C1H821JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121025944.07 KB30页217
IC封装资料_电源管理芯片_XL2596T.pdf
Datasheet3A150KHz40VBuckDCtoDCConverterXL2596Rev2.4www.xlsemi.com1Features�Wide4.5Vto40VInputVoltageRange�3.3V,5V,12V,andadjusta...
2024-12-121024489.14 KB14页11
IC封装资料_电容_1206CG103J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210241.05 MB27页18
IC封装资料_电容_F971C106MAA.pdf
108071119F97SeriesResin-MoldedChip,ImprovedReliabilityJ-LeadLEAD-FREECOMPATIBLECOMPONENTLHSW1W2SLHSW1W2SA,BCASEC,NCASEF97Type1CRat...
2024-12-121024334.34 KB5页126
IC封装资料_电容_0805F684M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210241.05 MB27页112
IC封装资料_电容_CC1206JRNPOBBN680.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121024998.46 KB11页284
IC封装资料_电容_GJM0335C1HR50BB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12102410.43 MB296页284
IC封装资料_电容_0201CG0R5B500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210241.05 MB27页18
IC封装资料_三极管_IRFB3607PBF.pdf
01/20/12Benefits�ImprovedGate,AvalancheandDynamicdv/dtRuggedness�FullyCharacterizedCapacitanceandAvalancheSOA�Enhancedbodydiode...
2024-12-121023410.76 KB11页225

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