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IC封装资料_连接器_9631S-24Z02-GFN4.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12984204.61 KB1页294
IC封装资料_三极管_WST3078.pdf
SymbolParameterRatingUnitsN-ChannelP-ChannelVDSDrain-SourceVoltage30-30VVGSGate-SourceVoltage±20±20VID@Tc=25℃ContinuousDrainCur...
2024-12-129841.81 MB11页236
IC封装资料_电容_GRM1555C1H1R5BA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12984920.26 KB29页227
IC封装资料_电容_TAJB157K002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12984210.32 KB7页177
IC封装资料_电容_GRM1555C1H1R8WA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12983920.26 KB29页156
IC封装资料_电容_0805CG5R0C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129831.05 MB27页188
IC封装资料_电源管理芯片_BQ24650RVAR.pdf
VCCREGNBTSTHIDRVPHLODRVGNDSRPSRNVFBVREFMPPSETTSTERM_ENSTAT1STAT2Q2L:10µHC94.7µFRSR20mΩbq24650C610uFQ1C12.2µFSolarCellHalfPanel...
2024-12-129832.99 MB38页21
IC封装资料_电感_MLF1608D82NMTD25.pdf
February2017INDUCTORSFebruary2017MultilayerFerriteMLF16081608[0603inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsMLF1608...
2024-12-12982311.11 KB11页203
IC封装资料_三极管_ZVN2120GTA.pdf
ZVN2120GDocumentnumber:DS33354Rev.3-21of6www.diodes.comFebruary2015©DiodesIncorporatedZVN2120G200VN-CHANNELENHANCEMENTMODEVERTICA...
2024-12-12982681.16 KB6页115
IC封装资料_电容_TAJD685M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12982210.32 KB7页196
IC封装资料_电容_GCJ188R71H472KA01D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-129824.17 MB96页202
IC封装资料_电容_T491B106K016AT.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comT2005_T491•5/8/20171Oneworld.OneKEMETB...
2024-12-129821.54 MB23页284
IC封装资料_连接器_DF12D_3.0_-60DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12982288.67 KB11页136
IC封装资料_连接器_1881464.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC0,5/4-G-2,5OrderNo.:1881464...
2024-12-12982251.47 KB5页53
IC封装资料_连接器_1843237.pdf
https://www.phoenixcontact.com/us/produkte/184323702.11.2012Page1/5Basestrip-MCV1.5/3-GF-3.5-1843237Pleasebeinformedthatthedatasho...
2024-12-12982187.11 KB5页97
IC封装资料_电容_C1608C0G1H682J080AA.pdf
August2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201i...
2024-12-129821.67 MB57页48
IC封装资料_电容_CL03A104MQ3NNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-129827.46 MB84页275
IC封装资料_连接器_1758063.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1298236.13 MB445页37
IC封装资料_电感_SWPA6045S150MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-129811.32 MB22页130
IC封装资料_电容_0402X104K250CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129811.26 MB20页154

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