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IC资料

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IC封装资料_电容_CL10B683MO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B683MO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12972360.77 KB3页227
IC封装资料_电源管理芯片_TL5209DR.pdf
VININOUTGNDVOUT1µF2.2µF470pFENADJ/BYPR1R2ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityTL5209SLVS581B...
2024-12-12972914.43 KB22页251
IC封装资料_电容_SPZ1CM221D10000RAXXX.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1297215.39 MB230页131
IC封装资料_连接器_DF12B_3.0_-36DP-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12972288.67 KB11页135
IC封装资料_电源管理芯片_SP706REN-L_TR.pdf
•www.maxlinear.com•Rev3.0.1SP706R/SP706S/SP706T,SP708S/SP708TDataSheet3.0V/3.3VLowPowerMicroprocessorSupervisoryCircuitsGeneralD...
2024-12-129721.04 MB22页243
IC封装资料_电容_GRM1885C1H680GA01D.pdf
GRM1885C1H680GA01_(0603,C0G:EIA,68pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-12972944.1 KB30页251
IC封装资料_电感_LQP03TN15NH02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12972281.03 KB12页25
IC封装资料_电容_CC0402KRX7R9BB301.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12971998.46 KB11页193
IC封装资料_电容_CL10C751JB81PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12971452.9 KB21页295
IC封装资料_电源管理芯片_XL8005.pdf
XLSEMIDatasheet100V0.5ASwitchingCurrentBuckPFMLEDConstantCurrentDriverXL8005Rev1.0www.xlsemi.com1Features�Wide24Vto100VInputVolta...
2024-12-12971225.35 KB7页38
IC封装资料_电感_SWPA6040S100MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-129711.32 MB22页73
IC封装资料_电容_CC0603MRX5R5BB475.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-129711.22 MB13页204
IC封装资料_电容_TAJD227K002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12971208.62 KB7页18
IC封装资料_连接器_F0502-B-14-20T.pdf
FPC0.50mmConnectorsF0502-B-XX-20T≥24D更多资料下载请到五八文库wk.58sms.com
2024-12-12971290.85 KB1页273
IC封装资料_连接器_DF3A-11P-2DSA.pdf
May.1.2021Copyright2021HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-12971222.32 KB1页289
IC封装资料_电容_1206CG220J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129701.05 MB27页102
IC封装资料_电容_CL32B106KAULNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL32B106KAULNNE·Product:Multi-layerCeramicCapacitor...
2024-12-129701.47 MB36页198
IC封装资料_连接器_A2541HWV-18P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-12970814.79 KB16页39
IC封装资料_电源管理芯片_MIC5225-3.3YM5-TR.pdf
MIC5225Ultra-LowQuiescentCurrent150mAµCapLowDropoutRegulatorIttyBittyisaregisteredtrademarkofMicrel,Inc.MicrelInc.•2180FortuneDr...
2024-12-12970303.18 KB9页101
IC封装资料_连接器_1729160.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/6http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogMKDSN1,5/6-5,08OrderNo.:17291...
2024-12-12970244.89 KB6页183

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