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IC资料

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IC封装资料_电容_1206B105K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129591.05 MB27页117
IC封装资料_电容_0805CG6R0C500N.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129591.05 MB27页235
IC封装资料_电容_GRM1555C1H151GA01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1295910.43 MB296页117
IC封装资料_电源管理芯片_LM2937IMP-5.0_NOPB.pdf
ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityLM2937SNVS100F–MARCH2000–REVISEDJULY2014LM2937500-mALowD...
2024-12-129592.1 MB31页230
IC封装资料_电感_MLG1005S22NJT000.pdf
INDUCTORSMay2016��MLG1005S1005[0402inch]**��JIS[EIA]��MLG1005S�MLG��更多资料下载请到五八文库wk....
2024-12-12959420.58 KB16页263
IC封装资料_电容_GRM1885C1H3R6BA01D.pdf
GRM1885C1H3R6BA01_(0603,C0G:EIA,3.6pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12958944.1 KB30页126
IC封装资料_电容_C1005C0G1H330F050BA.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[020...
2024-12-129581.65 MB57页291
IC封装资料_电源管理芯片_LT3837IFE_TRPBF.pdf
LT383713837fd47pF2.2nF10Ω22µF3k22.1k100kBAS16150k12k330Ω15Ω10Ω100nH8mΩSi7852DPSi7336ADPB0540W1.37k3.3nF20k1nF1µF0.1µF0.1µ...
2024-12-12958399.75 KB28页31
IC封装资料_电容_0603B474K160CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129581.26 MB20页29
IC封装资料_电感_NLV32T-3R3J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-12958325.74 KB6页104
IC封装资料_电感_LQW18ANR10G00D.pdf
SpecNo.JELF243A-0024Y-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW18AN□□□□00DREFERENCESPECIFICATION1.Scope...
2024-12-12958361.69 KB12页212
IC封装资料_连接器_DF12B_3.0_-20DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12958288.67 KB11页205
IC封装资料_电容_JMK105BJ105KV-F.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12958653.27 KB26页54
IC封装资料_电感_YP0301-101M.pdf
SMDPowerInductors-YP0301Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12958719.3 KB5页196
IC封装资料_三极管_DMP2215L-7.pdf
DMP2215LDocumentnumber:DS31125Rev.9-31of5www.diodes.comDecember2017©DiodesIncorporatedDMP2215LYMP-CHANNELENHANCEMENTMODEFIELDEFFE...
2024-12-12957552.54 KB5页187
IC封装资料_电容_TAJD686M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12957208.62 KB7页295
IC封装资料_连接器_FH12-22S-1SH_55_.pdf
May.1.2020Copyright2020HIROSEELECTRICCO.,LTD.AllRightsReserved.IncaseofconsiderationforusingAutomotiveequipment/devicewhichdemandh...
2024-12-12957339.76 KB6页220
IC封装资料_电容_GRM1555C1H331JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12957920.26 KB29页177
IC封装资料_电容_0201X225M6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-129571.05 MB27页256
IC封装资料_线性稳压器_SPX3819M5-L-1-8_TR.pdf
SPX3819500mALow-NoiseLDOVoltageRegulatorDecember2019Rev.2.0.51/13Rev.2.0.5GENERALDESCRIPTIONTheSPX3819isapositivevoltageregulatorw...
2024-12-129561.23 MB14页105

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