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IC资料

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IC封装资料_电源管理芯片_LT1086CT_PBF.pdf
1LT1086Seriessn10861086ffsAPPLICATIOSUFEATURESDESCRIPTIOUTYPICALAPPLICATIOUI3-TerminalAdjustableorFixed2.85V,3.3V,3.6V,5V,12VIOutp...
2024-12-121885304.79 KB16页168
IC封装资料_电容_GRM1555C1H510JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121885920.26 KB29页15
IC封装资料_电容_CL10C122JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121885259.58 KB3页38
IC封装资料_电容_0805X106K100CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218851.26 MB20页26
IC封装资料_电容_CL10B682KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B682KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1218851.45 MB36页9
IC封装资料_电容_CC0402JRNPO9BN270.pdf
PRODUCTSELECTIONGUIDE2014SMDRESISTORS+MLCCSMDCERAMICEMIFILTERCAPACITORS-X2Y®WIRELESSCOMPONENTSMULTILAYERCHIPVARISTORSwww.yageo.co...
2024-12-12188417.81 MB176页140
IC封装资料_电容_CL10A105KP8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A105KP8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1218841.42 MB36页41
IC封装资料_电感_NLV25T-1R5J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV25-PF2520[1008inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV25-PFTypeNLV-PFSeries...
2024-12-121884215.06 KB9页271
IC封装资料_电容_CC0402CRNPO9BN6R2.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121884998.46 KB11页193
IC封装资料_电源管理芯片_LM1117IMP-5.0_NOPB.pdf
ProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&CommunityReferenceDesignLM1117SNOS412N–FEBRUARY2000–REVISEDJANUAR...
2024-12-1218842.74 MB38页122
IC封装资料_电容_CC0201CRNPO9BNR80.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121884998.46 KB11页134
IC封装资料_电容_GRM1555C1H181JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121883920.26 KB29页32
IC封装资料_电容_GCM1555C1H150JA16D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1218834.17 MB96页42
IC封装资料_电容_RVT1V220M0505-TR.pdf
RVTSeriesHUAHUIStandardproduct标准品Operatingwithwidetemperaturerange-40~+105C適用於-40~+105°C的寬溫範圍Loadlifeof2000hours負荷...
2024-12-1218831.08 MB3页4
IC封装资料_连接器_DF12E_3.5_-40DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121883288.67 KB11页136
IC封装资料_电容_CL10C100FB8NNNC.pdf
SPECIFICATION·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CAP,10,50V,±1,C0G...
2024-12-121883359.13 KB3页124
IC封装资料_连接器_KF2EDGCV-X-5.08-14P.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121883627.15 KB1页275
IC封装资料_电感_YSPI0750-1R5M.pdf
SMDPowerInductors-YSPI0750Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-121882700.46 KB5页273
IC封装资料_电容_CL10B474KO8VPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B474KO8VPNC●Product:Multi-layerCeramicCapacitorCAP,470㎋,16V,±10%,X7R,0603●AEC-Q200Quali...
2024-12-1218825.82 MB36页231
IC封装资料_电容_TAJE227M006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121882210.32 KB7页5

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