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IC资料

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IC封装资料_电源管理芯片_LTC3204EDC-5_TRMPBF.pdf
LTC3204-3.3/LTC3204-5/LTC3204B-3.3/LTC3204B-513204faFEATURESDESCRIPTIOUTYPICALAPPLICATIOUTheLTC®3204-3.3/LTC3204-5/LTC3204B-3.3/L...
2024-12-12741709.93 KB12页288
IC封装资料_电容_C823A222J40C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-127402.9 MB5页205
IC封装资料_电容_CL10A106MPNNHBC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12740259.58 KB3页239
IC封装资料_电容_CL10A106KQ8NNWC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12740259.57 KB3页260
IC封装资料_电源管理芯片_LT3502IDC_TRPBF.pdf
LT3502/LT3502A13502fdFeaturesapplicationsDescription1.1MHz/2.2MHz,500mAStep-DownRegulatorsin2mm×2mmDFNandMS10TheLT®3502/LT3502Aa...
2024-12-12740543.36 KB24页247
IC封装资料_电感_NLV32T-3R9J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-12740224.35 KB10页142
IC封装资料_连接器_1754711.pdf
https://www.phoenixcontact.com/us/produkte/175471119.10.2012Page1/7Basestrip-MSTB2,5/16-G-1754711Pleasebeinformedthatthedatashowni...
2024-12-12740206.48 KB7页153
IC封装资料_连接器_1803400.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1274036.13 MB445页87
IC封装资料_电容_TAJC157M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12740210.32 KB7页71
IC封装资料_三极管_IRFR3709ZTRPBF.pdf
www.irf.com112/2/04IRFR3709ZPbFIRFU3709ZPbFHEXFET��PowerMOSFETNotes��through�areonpage11ApplicationsBenefits�VeryLowRDS(on...
2024-12-12739354.07 KB12页72
IC封装资料_电容_GRM188R61A105KA61D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12739944.07 KB30页237
IC封装资料_电容_CL10B105KP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12739259.58 KB3页271
IC封装资料_电感_YNR4018-6R8M.pdf
SMDPowerInductors-YNR4018Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12739661.38 KB5页122
IC封装资料_电容_CL10F104ZA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12739259.58 KB3页223
IC封装资料_电容_CL10C471JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12739316.29 KB3页249
IC封装资料_电容_0805B103J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127391.05 MB27页248
IC封装资料_电容_CC0805KRX7RYBB331.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-127391.22 MB13页220
IC封装资料_电容_0402CG1R5C500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127391.05 MB27页58
IC封装资料_电感_SWPA252012S220MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-127381.32 MB22页136
IC封装资料_连接器_1733570.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/6http://www.phoenixcontact.deFeb24,2010ExtractfromtheonlinecatalogSMKDSP1,5/2-5,08OrderNo.:1733...
2024-12-12738230.12 KB6页169

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