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IC资料

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IC封装资料_电容_0805F475M500NT_2K.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127081.05 MB27页45
IC封装资料_电容_06035C104KAT2A.pdf
18GeneralSpecificationsPARTNUMBER(SEEPAGE4FORCOMPLETEPARTNUMBEREXPLANATION)08055СMA2AT103Size(L”xW”)DielectricX7R=CCapacitanceT...
2024-12-12707593.79 KB4页116
IC封装资料_电容_CL10B472KB8SFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12707259.57 KB3页280
IC封装资料_电容_CL10B222KC85PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12707452.9 KB21页243
IC封装资料_电容_UMK325B7475KM-T.pdf
NoticeforTAIYOYUDENProducts[ForGeneralElectronicEquipment]PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.REMINDERS■Producti...
2024-12-12707653.27 KB26页37
IC封装资料_电容_GRM1555C1H471JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12707920.26 KB29页268
IC封装资料_接口及驱动芯片_ISO1042BQDWVRQ1.pdf
1243765TXDVCC1RXDGND1CANHCANL8VCC2MCURXDTXDVDDDGNDDigitalGroundISOGroundCANBusGalvanicIsolationBarrierISO1042-Q1GND2VCC1VCC2Produc...
2024-12-127063.07 MB43页233
IC封装资料_电容_CL03B103KP3NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL03A225MQ3CRNC·Product:Multi-layerCeramicCapacitor...
2024-12-127061.42 MB36页243
IC封装资料_电感_SWPA3010S150MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-127061.32 MB22页113
IC封装资料_电感_SDCL1608C10NJTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-12706376.19 KB4页298
IC封装资料_电容_0402HQ150J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127061.05 MB27页207
IC封装资料_电感_NLV32T-3R3J-PF.pdf
INDUCTORSJanuary2015WoundFerriteNLV32-PF3225[1210inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsNLV32-PFTypeNLV-PFSeries...
2024-12-12706224.35 KB10页144
IC封装资料_电容_C242A104K2SC000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-127062.29 MB5页35
IC封装资料_电感_YP0302-100M.pdf
SMDPowerInductors-YP0302Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-12706775.67 KB5页255
IC封装资料_连接器_AFC01-S05H1A-00.pdf
更多资料下载请到五八文库wk.58sms.com深圳市钜硕电子有限公司AFC01-S**F**-00
2024-12-127061.58 MB1页170
IC封装资料_电容_CL21C070DBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-127067.46 MB84页42
IC封装资料_电容_0402B471J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-127061.26 MB20页290
IC封装资料_电感_LQG15HSR22J02D.pdf
SpecNo.JELF243B-0010S-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQG15HS□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12706361.38 KB11页4
IC封装资料_电源管理芯片_F2406S-1W.pdf
YUANDC-DCCONVERTERF系列FxxxxS-xW3KVDC隔离0.1W～2W非稳压单输出SIP7脚封装输入电压3.3V/5V/9V/12V/15V/24VDC输出电压3.3V/5V/9V/12V/15V/...
2024-12-12705489.36 KB4页227
IC封装资料_电容_GRM1555C1HR30BA01D.pdf
GRM1555C1HR30BA01_(0402,C0G:EIA,0.3pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12705944.32 KB30页274

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