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IC资料

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IC封装资料_电容_0402B471K250CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218711.26 MB20页176
IC封装资料_电容_CL10C820JC81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C820JC81PNC●Product:Multi-layerCeramicCapacitorCAP,82㎊,100V,±5%,C0G,0603●AEC-Q200Qualif...
2024-12-1218715.8 MB36页267
IC封装资料_电容_GRM1885C1H120FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121871944.07 KB30页111
IC封装资料_电源管理芯片_XL7007.pdf
XLSEMI1.2A180KHz70VBuckDCtoDCConverterXL7007Rev1.01Features�Wide10Vto70VInputVoltageRange�OutputAdjustablefrom1.25Vto50V�Maximu...
2024-12-1218711.52 MB10页282
IC封装资料_电源管理芯片_LT3080EST_PBF.pdf
LT308013080fcAdjustable1.1ASingleResistorLowDropoutRegulatorTheLT®3080isa1.1Alowdropoutlinearregulatorthatcanbeparalleledtoincrea...
2024-12-121871459.19 KB28页93
IC封装资料_电源管理芯片_LT3652IMSE_PBF.pdf
LT365213652feFormoreinformationwww.linear.com/LT3652TYPICALAPPLICATIONDESCRIPTIONPowerTracking2ABatteryChargerforSolarPowerTheLT®...
2024-12-121871600.17 KB26页96
IC封装资料_电容_0603N6R8D500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218701.26 MB20页35
IC封装资料_电感_NLV32T-270J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121870325.74 KB6页59
IC封装资料_连接器_SM10B-GHS-TB.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-121870660.99 KB4页129
IC封装资料_电容_1206B272K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218701.05 MB27页54
IC封装资料_电容_1206B271K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218701.05 MB27页279
IC封装资料_电源管理芯片_TPS5430DDAR.pdf
VINNCNCENAGNDVSENSEBOOTPHTPS5430/31VINVOUT956070809010000.511.52.533.5Efficiency−%IOutput�CurrentAO��Efficiency�vs�Output�C...
2024-12-1218691.16 MB35页271
IC封装资料_电容_C322J222J30C000.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-1218694.24 MB7页73
IC封装资料_电感_YP0705-101M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121869721.48 KB5页55
IC封装资料_电容_CL10B103MB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B103MB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121869360.79 KB3页55
IC封装资料_电容_CC1206KRX7RABB103.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121869998.46 KB11页55
IC封装资料_电容_CL10B105KO84PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B105KO84PNC●Product:Multi-layerCeramicCapacitorCAP,1㎌,16V,±10%,X7R,0603●AEC-Q200Qualifi...
2024-12-1218695.82 MB36页112
IC封装资料_电容_0402B183K160CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218691.26 MB20页102
IC封装资料_连接器_1727049.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12186836.13 MB445页70
IC封装资料_连接器_BM28B0.6-16DP2-0.35V_53_.pdf
12019.7④0.35mmpitch,0.6mmheight,BoardtoBoardorBoardtoFPCConnectorswithRatedCurrentUpto5ABM28Series■Features1.Ratedcurrent5A2Powe...
2024-12-121868562.52 KB8页78

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