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IC封装资料_电感_SWPA4018S151MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1218701.32 MB22页187
IC封装资料_电源管理芯片_LT3080EST_PBF.pdf
LT308013080fcAdjustable1.1ASingleResistorLowDropoutRegulatorTheLT®3080isa1.1Alowdropoutlinearregulatorthatcanbeparalleledtoincrea...
2024-12-121870459.19 KB28页93
IC封装资料_电容_0402B471K250CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218701.26 MB20页176
IC封装资料_连接器_SM10B-GHS-TB.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-121870660.99 KB4页129
IC封装资料_电容_GRM188R71H202KA01D.pdf
GRM188R71H202KA01_(0603,X7R:EIA,2000pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121870962.46 KB30页111
IC封装资料_电源管理芯片_TPS5430DDAR.pdf
VINNCNCENAGNDVSENSEBOOTPHTPS5430/31VINVOUT956070809010000.511.52.533.5Efficiency−%IOutput�CurrentAO��Efficiency�vs�Output�C...
2024-12-1218691.16 MB35页271
IC封装资料_电感_YP0705-101M.pdf
SMDPowerInductors-YP0705Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Highc...
2024-12-121869721.48 KB5页55
IC封装资料_电容_1206B272K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218691.05 MB27页54
IC封装资料_电容_GRM1885C1H120FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121869944.07 KB30页111
IC封装资料_电源管理芯片_XL7007.pdf
XLSEMI1.2A180KHz70VBuckDCtoDCConverterXL7007Rev1.01Features�Wide10Vto70VInputVoltageRange�OutputAdjustablefrom1.25Vto50V�Maximu...
2024-12-1218691.52 MB10页282
IC封装资料_电感_NLV32T-270J-EFD.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121869325.74 KB6页59
IC封装资料_电容_CC1206KRX7RABB103.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121868998.46 KB11页55
IC封装资料_电容_CL10B103MB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B103MB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121868360.79 KB3页55
IC封装资料_电容_CL10B105KO84PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B105KO84PNC●Product:Multi-layerCeramicCapacitorCAP,1㎌,16V,±10%,X7R,0603●AEC-Q200Qualifi...
2024-12-1218685.82 MB36页112
IC封装资料_电容_0603N6R8D500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218681.26 MB20页35
IC封装资料_电容_GRM1885C1H1R5CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121868944.07 KB30页230
IC封装资料_电容_1206B271K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218681.05 MB27页279
IC封装资料_电容_0402B183K160CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218681.26 MB20页102
IC封装资料_连接器_1727049.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12186836.13 MB445页70
IC封装资料_连接器_1757307.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12186736.13 MB445页164

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