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IC资料

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IC封装资料_三极管_IPB042N10N3GATMA1.pdf
1IPB042N10N3GRev.2.9,2017-07-17FinalDataSheetD²PAKDrainPin2,TabGatePin1SourcePin3MOSFETOptiMOSª3Power-Transistor,100VFeatures•N...
2024-12-126451020.59 KB10页136
IC封装资料_三极管_DMN62D0LFB-7.pdf
DMN62D0LFBDocumentnumber:DS35409Rev.7-31of7www.diodes.comJanuary2019©DiodesIncorporatedDMN62D0LFBADVANCEINFORMATIONNEWPRODUCTN-CH...
2024-12-12645689.84 KB7页137
IC封装资料_三极管_2V7002LT1G.pdf
©SemiconductorComponentsIndustries,LLC,2013March,2019−Rev.91PublicationOrderNumber:2N7002L/D2N7002L,2V7002LSmallSignalMOSFET60V,...
2024-12-12645182.71 KB4页158
IC封装资料_连接器_DF12B_3.0_-14DS-0.5V_86_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-12645288.67 KB11页200
IC封装资料_电源管理芯片_MCP73831T-2ATI_OT.pdf
2005-2014MicrochipTechnologyInc.DS20001984G-page1MCP73831/2Features:•LinearChargeManagementController:-IntegratedPassTransistor...
2024-12-12645915.61 KB28页262
IC封装资料_连接器_5-1634503-1.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-12645154.12 KB1页98
IC封装资料_电源管理芯片_LTC4417CUF_TRPBF.pdf
LTC441714417fTypicalapplicaTionFeaTuresDescripTionPrioritizedPowerPath™ControllerTheLTC®4417connectsoneofthreevalidpowersupplies...
2024-12-12645515.8 KB32页74
IC封装资料_电容_0201CG3R6C250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126451.05 MB27页296
IC封装资料_电容_TAJB334K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12644210.32 KB7页122
IC封装资料_连接器_SM12B-GHS-TBT.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-12644660.99 KB4页101
IC封装资料_电容_JMK063ABJ105MP-F.pdf
注意■本产品目录所记载的内容为2016年10月之内容。因改良等原因，可能会不经预告而变更记载内容，所以请务必在使用前先确认最新的产品信息...
2024-12-126441.83 MB52页72
IC封装资料_电容_GRM1885C1H8R2CA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12644944.07 KB30页274
IC封装资料_电容_GRM21BR61C226ME44L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1264410.43 MB296页292
IC封装资料_电容_GJM1555C1H4R0CB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1264410.43 MB296页141
IC封装资料_电感_YNR4030-1R5M.pdf
SMDPowerInductors-YNR4030Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12643664.95 KB5页89
IC封装资料_电容_GCM2165C1H102JA16D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-126434.17 MB96页277
IC封装资料_电感_LQW18AN6N2C00D.pdf
SpecNo.JELF243A-0024Y-01P.1/11MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQW18AN□□□□00DREFERENCESPECIFICATION1.Scope...
2024-12-12643333.23 KB11页203
IC封装资料_电容_GCM188R71H153KA37D.pdf
August2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201i...
2024-12-126431.67 MB57页257
IC封装资料_电感_LQP03TN3N6B02D.pdf
SpecNo.JELF243C-0015T-01P.1/12MURATAMFG.CO.,LTDReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP03TN□□□□02DREFERENCESPECIFICATION1.Scope...
2024-12-12643281.03 KB12页132
IC封装资料_电感_CBMF1608T470K.pdf
SpecSheethttp://www.ty-top.comThedataisreferenceonly.Electricalcharacteristicsvarydependingonenvironmentormeasurementcondition.TAI...
2024-12-12643364.38 KB3页79

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