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IC资料

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IC封装资料_电容_0805B221K501T.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218631.05 MB27页95
IC封装资料_电容_GJM0335C1E1R8WB01D.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12186310.43 MB296页293
IC封装资料_电感_SDCL1005C27NJTDF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2013/05/15SunlordIndustrialPark,Dafuyu...
2024-12-121862376.19 KB4页87
IC封装资料_接口及驱动芯片_MAX3295AUT+T.pdf
GeneralDescriptionTheMAX3293/MAX3294/MAX3295low-power,high-speedtransmittersforRS-485/RS-422commu-nicationoperatefromasingle+3.3Vp...
2024-12-1218622.08 MB12页34
IC封装资料_电感_LQP15MN9N1B02D.pdf
SpecNo.JELF243C-0007P-01P.1/9MURATAMFG.CO.,LTD.ReferenceOnlyCHIPCOIL(CHIPINDUCTORS)LQP15MN□□□□02DReferenceSpecification1.Scope...
2024-12-121862245 KB9页227
IC封装资料_电源管理芯片_TPS7A7002DDAR.pdf
0501001502002503003504000500m11.52OutputCurrent(A)DropoutVoltage(mV)−40°C25°C125°CG003INENNCCINCOUTInputVoltageOutputVoltageTP...
2024-12-1218621.52 MB22页199
IC封装资料_信号隔离芯片_ADuM1300ARW.pdf
Triple-ChannelDigitalIsolatorsDataSheetADuM1300/ADuM1301Rev.KDocumentFeedbackInformationfurnishedbyAnalogDevicesisbelievedtobeaccu...
2024-12-121862698.36 KB32页60
IC封装资料_电源管理芯片_SGM2019-3_3YN5GTR.pdf
SGM2019LowPower,LowDropout,RF-LinearRegulatorsGENERALDESCRIPTIONTheSGM2019serieslow-power,low-noise,low-dropout,CMOSlinearvoltager...
2024-12-121862468.67 KB16页31
IC封装资料_连接器_AFC01-S46FCA-00.pdf
CUSTOMER:CUSTOMERP/N:PARTNAME:PARTNO.:0.5mmPitchH=2.0mmSMT掀盖式DAET:2016.05.08DAET:2016.05.10DAET:2016.05.12李涛设计朱成峰审核朱...
2024-12-1218621.85 MB10页114
IC封装资料_连接器_DF12E_3.5_-36DP-0.5V_81_.pdf
A1930.5mmPitchSMTBoard-to-BoardConnectorDF12Series■Features1.BroadVariationsofStackingHeightInadditionto0.5mmpitchultra-miniature...
2024-12-121861288.67 KB11页153
IC封装资料_电容_CC1812KKX7RCBB222.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121861998.46 KB11页89
IC封装资料_电容_CC0805KRX7RBBB682.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-121861998.46 KB11页147
IC封装资料_连接器_9631S-26Z02-GFN4.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121861204.61 KB1页236
IC封装资料_连接器_53398-0271.pdf
TABLE11番号NO.部品PART材質MATERIAL①ハウジングHOUSINGポリアミド(PA),UL94V-0,GLASS-FILLED,色:ナチュラル(ベージュ)POLYAMIDE(PA),UL94...
2024-12-121861855.65 KB4页257
IC封装资料_电感_NLV25T-1R0J-EF.pdf
Pleasebesuretorequestdeliveryspecificationsthatprovidefurtherdetailsonthefeaturesandspecificationsoftheproductsforproperandsafeuse...
2024-12-121860316.79 KB6页83
IC封装资料_三极管_AUIRF7484QTR.pdf
AUIRF7484QVDSS40VRDS(on)max.10mID14ADescriptionSpecificallydesignedforAutomotiveapplications,thisStripePlanardesignofHEXFET®P...
2024-12-121860500.94 KB11页139
IC封装资料_电容_R76UR32204030J.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comF3034_R76•9/19/20161Oneworld.OneKEMETB...
2024-12-1218602.62 MB25页261
IC封装资料_电容_0603X106K6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218601.05 MB27页205
IC封装资料_电容_GRM155R60J474KE19D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121860920.26 KB29页262
IC封装资料_连接器_1804852.pdf
https://www.phoenixcontact.com/us/produkte/180485219.10.2012Page1/7Basestrip-PC4/8-G-7,62-1804852Pleasebeinformedthatthedatashowni...
2024-12-121859210.37 KB7页280

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