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IC资料

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IC封装资料_电感_MLF1608E8R2JT000.pdf
February2017INDUCTORSFebruary2017MultilayerFerriteMLF16081608[0603inch]**DimensionsCodeJIS[EIA]InductorsforStandardCircuitsMLF1608...
2024-12-121834311.11 KB11页238
IC封装资料_电感_LQG15HS5N1S02D.pdf
SpecNo.:JELF243B_0010T-01P1/13MURATAMFGCO.,LTDCHIPCOILS(CHIPINDUCTORS)LQG15HS□□□□02□REFERENCESPECIFICATION1.ScopeThisreferenc...
2024-12-121834454.09 KB13页118
IC资料_HLS27DRG0145C (BANNER).pdf
DatasheetBanner'sHLS27HazardousLocationLEDStripLighthasasturdyaluminumhousingandisencasedinashatterproof,UV-stabilized,polycarbona...
2024-12-151834673.17 KB8页240
IC封装资料_电容_GCM32DR71C106KA37L.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-1218334.17 MB96页199
IC资料_K50ANFF100GXDQ (BANNER).pdf
DatasheetCompact,Single-PointDevicesforError-ProofingofBin-PickingOperationsToviewordownloadthelatesttechnicalinformationaboutthis...
2024-12-151833583.23 KB8页174
IC封装资料_电感_MWSA0402-3R3MT.pdf
SunlordIndusSunloMoldedOperatingFEATUREMetalmaClosedmHalogenAPPLICAServer,GraphicIndustriaPRODUCMWS①①MWSA②041004120...
2024-12-121833319.07 KB8页201
IC封装资料_电容_0805CG222J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218331.05 MB27页128
IC封装资料_电容_CL10X226MR8NUNE.pdf
SPECIFICATIONSupplier:Samsungelectro-mechanicsSamsungP/N:CL10X226MR8NUNEProduct:Multi-layerCeramicCapacitorDescription:CAP...
2024-12-121833222.28 KB2页42
IC封装资料_连接器_M55-6011242R.pdf
更多资料下载请到五八文库wk.58sms.com
2024-12-121833318.48 KB3页242
IC封装资料_电感_YPRH1209-220M.pdf
SMDPowerInductors-YPRH1209Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Hig...
2024-12-121833736.23 KB5页156
IC封装资料_连接器_A2541HWV-32P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121833814.73 KB16页74
IC封装资料_三极管_DMG7430LFG-7.pdf
DMG7430LFGDocumentnumber:DS35497Rev.5-21of7www.diodes.comFebruary2012©DiodesIncorporatedDMG7430LFGADVANCEINFORMATIONPOWERDIisareg...
2024-12-121833304.58 KB7页253
IC封装资料_连接器_SM08B-GHS-TBT.pdf
GHCONNECTORGHCONNECTORGHCONNECTORGHCONNECTOR1.25mmpitch/DisconnectableCrimpstyleconnectorsEmbossTapeGHCONNECTORGHCONNECTORGHCONNEC...
2024-12-121832661 KB4页274
IC封装资料_电容_CL10B333KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B333KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1218321.45 MB36页272
IC封装资料_电容_C0603X7R471KGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-1218321.92 MB48页218
IC封装资料_电容_0603B362K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218321.05 MB27页277
IC封装资料_电感_SWPA4020S220MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1218311.32 MB22页126
IC封装资料_电源管理芯片_UC2844BD1R2G.pdf
©SemiconductorComponentsIndustries,LLC,2013August,2013−Rev.111PublicationOrderNumber:UC3844B/DUC3844B,UC3845B,UC2844B,UC2845BHig...
2024-12-121831482.14 KB19页78
IC封装资料_电容_GRM1885C1H681GA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121830944.07 KB30页74
IC封装资料_电容_CL10C161JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121830340.14 KB3页39

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