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IC资料

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IC封装资料_连接器_A2541HWV-26P.pdf
A2541SERIESCHANGJIANGCONNECTORSTEL:86-755-2995911929959129FAX:86-755-29959139Http://www.CJT.cn2.54mmpitchwiretoboardconnectorSpeci...
2024-12-121806814.83 KB16页149
IC封装资料_电容_CL10B562KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B562KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121806361.46 KB3页292
IC封装资料_电容_FC0H224ZFTBR24.pdf
1©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comS6011_FC•3/29/2017Oneworld.OneKEMETBe...
2024-12-121806867.01 KB16页70
IC封装资料_电容_TAJB474M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121805210.32 KB7页236
IC封装资料_电容_CL31A226KAHNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL31A226KAHNNNE·Product:Multi-layerCeramicCapacitor...
2024-12-1218051.48 MB36页142
IC封装资料_三极管_SI4062DY-T1-GE3.pdf
VishaySiliconixSi4062DYDocumentNumber:62857S13-1383-Rev.A,17-Jun-13www.vishay.com1Thisdocumentissubjecttochangewithoutnotice.THEPR...
2024-12-121805348.89 KB10页79
IC封装资料_电容_0402B103M500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218051.26 MB20页299
IC封装资料_电容_GCM155R71H223KA55D.pdf
Lsize1.0±0.05mmWsize0.5±0.05mmTsize0.5±0.05mmExternalterminalwidthe0.15to0.35mmDistancebetweenexternalterminalsg0.3mmmin.Sizeco...
2024-12-1218053.22 MB2页4
IC封装资料_电容_0603N471J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218051.26 MB20页278
IC封装资料_电容_CL10B104KB85PNL.pdf
●Supplier:SamsungElectro-MechanicsCL10B104KB85PNL●Product:Multi-layerCeramicCapacitorCAP,100㎋,50V,±10%,X7R,0603●AEC-Q200Quali...
2024-12-1218055.82 MB36页90
IC封装资料_电容_0805B106K100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218041.05 MB27页125
IC封装资料_电感_NLCV25T-100K-EFRD.pdf
•Allspecificationsaresubjecttochangewithoutnotice.•ConformitytoRoHSDirective:Thismeansthat,inconformitywithEUDirective2002/95/EC...
2024-12-121804249.79 KB16页58
IC封装资料_电感_SWPA5020S3R3MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1218041.32 MB22页44
IC封装资料_电源管理芯片_LM317DCYR.pdf
R1240�R22.4k�INPUTOUTPUTADJUSTLM317VIRS0.2�Copyright©2016,TexasInstrumentsIncorporatedProductFolderSample&BuyTechnicalDocument...
2024-12-1218041.25 MB32页210
IC封装资料_电容_CL10B472KB8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121804259.58 KB3页10
IC封装资料_电感_YSPI0530-R68M.pdf
SMDPowerInductors-YSPI0530Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121803698.99 KB4页201
IC封装资料_电容_CC0402KRX7R7BB563.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1218031.22 MB13页17
IC封装资料_电容_CL10B473KB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121803259.57 KB3页23
IC封装资料_电容_GRM1885C1H4R7BA01D.pdf
GRM1885C1H4R7BA01_(0603,C0G:EIA,4.7pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121803944.09 KB30页252
IC封装资料_电感_MLZ1608M220WTD25.pdf
May2017INDUCTORSMultilayerFerriteMLZ16081608[0603inch]**DimensionsCodeJIS[EIA]InductorsforDecouplingCircuitsMLZ1608TypeMLZSeries更...
2024-12-121803335.39 KB10页144

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