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IC封装资料_电容_TAJB155M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12139210.32 KB7页208
IC封装资料_电感_YSPI0530-R47M.pdf
SMDPowerInductors-YSPI0530Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-121983698.99 KB4页10
IC封装资料_电容_TAJB155K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12567210.32 KB7页297
IC封装资料_电容_TAJB155K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12263210.32 KB7页212
IC封装资料_电源管理芯片_TPS5430DDAR.pdf
VINNCNCENAGNDVSENSEBOOTPHTPS5430/31VINVOUT956070809010000.511.52.533.5Efficiency−%IOutput�CurrentAO��Efficiency�vs�Output�C...
2024-12-1218691.16 MB35页271
IC封装资料_电容_TAJB155K025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12908210.32 KB7页144
IC封装资料_电容_GCJ188R72A472KA01D.pdf
ChipMultilayerCeramicCapacitorsforAutomotive2017C03E.pdfJun22,2017更多资料下载请到五八文库wk.58sms.comEURoHSCompliant��...
2024-12-129004.17 MB96页181
IC封装资料_电容_CL10C5R6BB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12964259.58 KB3页91
IC封装资料_电容_CL10C5R1CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121399259.58 KB3页42
IC封装资料_电容_TAJB156K010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12573210.32 KB7页280
IC封装资料_电容_1206X476M6R3NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122761.05 MB27页194
IC封装资料_电容_TAJB155M050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12508210.32 KB7页263
IC封装资料_电容_TAJB155M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121521210.32 KB7页46
IC封装资料_电感_YSPI0724-1R5M.pdf
SMDPowerInductors-YSPI0724Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-12807698.31 KB4页168
IC封装资料_电容_GCJ188R91E334KA01D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-123985.94 MB73页219
IC封装资料_电感_YSPI0718-2R2M.pdf
SMDPowerInductors-YSPI0718Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Mol...
2024-12-12200696.54 KB4页58
IC封装资料_电源管理芯片_TPS5450DDARG4.pdf
VINNCNCENAGNDVSENSEBOOTPHVINVOUTSimplified�SchematicEfficiency�vs�Output�Current50556065707580859095100I-OutputCurrent-AOEffic...
2024-12-124531.87 MB29页177
IC封装资料_嵌入式微处理器_HC32L110C6PA-TSSOP20.pdf
HC32L110系列32位ARM®Cortex®-M0+微控制器HC32L110C6UA/HC32L110C6PA/HC32L110C4UAHC32L110C4PA/HC32L110B6PA/HC32L110B4PA数据手册更多...
2024-12-1218391.76 MB46页276
IC封装资料_电容_GRM188R72E331KW07D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12886944.07 KB30页21
IC封装资料_电容_TAJB156M010RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12680210.32 KB7页117

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