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IC封装资料_电容_TAJB157K002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12984210.32 KB7页177
IC封装资料_电容_1206X476M160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-123071.05 MB27页91
IC封装资料_电容_GCJ216R71H102KA01D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-126185.94 MB73页109
IC封装资料_电感_YSPI0724-150M.pdf
SMDPowerInductors-YSPI0724Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-12863698.31 KB4页82
IC封装资料_电容_CL10C5R6DB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12851259.58 KB3页110
IC封装资料_电容_GCJ188R92A473KA01D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-12625.94 MB73页91
IC封装资料_连接器_1803361.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1211536.13 MB445页251
IC封装资料_嵌入式微处理器_MS51FB9AE.pdf
MS51Apr.08,2019Page1of47Rev1.00MS51系列规格书1T80518位微控制器NuMicro®家族MS5116K系列规格书Theinformationdescribedinthisdocumenti...
2024-12-1216062.22 MB47页173
IC封装资料_电容_TAJB224M050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121215210.32 KB7页181
IC封装资料_电容_TAJB224K050RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12329210.32 KB7页50
IC封装资料_电容_TAJB157M006RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12859210.32 KB7页48
IC封装资料_嵌入式微处理器_SNB8P25011DSG.pdf
SN8P2501D8-BitMicro-ControllerSONiXTECHNOLOGYCO.,LTDPage1Version1.5SN8P2501DUSER’SMANUALVersion1.5SN8P2501DSN8P25011DSSOONNiiXX88...
2024-12-129312.34 MB96页186
IC封装资料_电容_TAJB225K035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121952210.32 KB7页238
IC封装资料_电容_TAJB225K025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121937210.32 KB7页51
IC封装资料_电容_TAJB225K020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121084210.32 KB7页41
IC封装资料_电容_GCJ216R71H103KA01D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1215875.94 MB73页14
IC封装资料_电容_TAJB225M035RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121341210.32 KB7页83
IC封装资料_电源管理芯片_TPS23750PWPR.pdf
1FEATURESDESCRIPTIONAPPLICATIONSTPS23750TLV431CTMRVBIASTMRFREQGATECOMRSNAUXRSPFBCOMPVBIASVDDVBIASSEN58V0.1F�RDETRCLASSVDDVSSCLASS...
2024-12-1212881.56 MB41页238
IC封装资料_电容_TAJB225M025RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12560210.32 KB7页251
IC封装资料_电容_CL10C6R2CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121398259.58 KB3页20

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