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IC封装资料_电容_TAJB156K020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12113210.32 KB7页122
IC封装资料_电容_CL10C5R6CB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12217316.21 KB3页240
IC封装资料_电容_TAJB156K016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121820210.32 KB7页160
IC封装资料_电容_CL10C5R6CB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121891259.58 KB3页160
IC封装资料_电容_GCJ188R91H104KA01D.pdf
汽车用片状多层陶瓷电容器汽车用片状多层陶瓷电容器MurataManufacturingCo.,Ltd.C03C-4.pdf14.09.09C03C-4.pdf14.09.09•本PDF产品目录是从...
2024-12-1215735.94 MB73页287
IC封装资料_电容_1206X476M100NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125361.05 MB27页148
IC封装资料_电感_YSPI0724-4R7M.pdf
SMDPowerInductors-YSPI0724Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-121612698.31 KB4页59
IC封装资料_嵌入式微处理器_HC32L130F8UA-QFN32.pdf
HC32L130系列/HC32L136系列32位ARM®Cortex®-M0+微控制器数据手册产品特性⚫48MHzCortex-M0+32位CPU平台⚫HC32L130/HC32L136系列具有灵活...
2024-12-1217121.91 MB73页24
IC封装资料_电感_YSPI0724-2R2M.pdf
SMDPowerInductors-YSPI0724Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjysmd.com.cn-1-■Features●M...
2024-12-12805698.31 KB4页184
IC封装资料_电容_TAJB156M020RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121977210.31 KB7页290
IC封装资料_电容_TAJB156M016RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121424210.32 KB7页169
IC封装资料_电源管理芯片_TPS5450QDDARQ1.pdf
VINNCNCENAGNDVSENSEBOOTPHVINVOUTSimplified�SchematicEfficiency�vs�Output�Current50556065707580859095100I-OutputCurrent-AOEffic...
2024-12-122761.9 MB33页67
IC封装资料_嵌入式微处理器_IAP15W4K61S4-30I-LQFP32.pdf
全部175˚C8小时高温烘烤高可靠制造保证1T8051微处理器STC掉电模式:<0.1µA,可外中断或专用定时器唤醒看门狗集成MAX810专用复位电路8路15位...
2024-12-121528972.17 KB5页85
IC封装资料_嵌入式微处理器_HC32L136J8TA-LQ48.pdf
HC32L130系列/HC32L136系列32位ARM®Cortex®-M0+微控制器数据手册产品特性⚫48MHzCortex-M0+32位CPU平台⚫HC32L130/HC32L136系列具有灵活...
2024-12-127551.85 MB77页205
IC封装资料_电容_GRM188R72E471KW07D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12270944.07 KB30页162
IC封装资料_电容_TAJB157M004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-1296210.32 KB7页263
IC封装资料_电容_CL10C5R6CC81PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121252452.9 KB21页7
IC封装资料_电容_TAJB157M002RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-12242210.32 KB7页156
IC封装资料_电容_1210B103K102NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219771.05 MB27页100
IC封装资料_电容_TAJB157K004RNJ.pdf
6111315HOWTOORDERTechnicalData:Alltechnicaldatarelatetoanambienttemperatureof+25°CCapacitanceRange:0.10μFto2200μFCapacitanceTol...
2024-12-121404210.32 KB7页263

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