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IC封装资料_电感_SWPA4018S150MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1219131.32 MB22页274
IC封装资料_电容_CL10A225KQ5LNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KQ5LNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213521.45 MB36页48
IC封装资料_电源管理芯片_LTC3405AES6-1.8_TRPBF.pdf
1LTC3405A-1.5/LTC3405A-1.83405a1518fa■HighEfficiency:Upto93%■VeryLowQuiescentCurrent:Only20µADuringOperation■300mAOutputCurren...
2024-12-121358287.5 KB16页111
IC封装资料_电源管理芯片_LTC3404EMS8_TRPBF.pdf
1LTC34043404fbAPPLICATIOSUFEATURESDESCRIPTIOUTYPICALAPPLICATIOU■HighEfficiency:Upto95%■VeryLowQuiescentCurrent:Only10μADuringOp...
2024-12-121966293.17 KB16页6
IC封装资料_电容_0805B223K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214791.05 MB27页64
IC封装资料_电容_CL03C1R5CA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-126041.4 MB36页86
IC封装资料_电感_SWPA6045S6R8MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-128151.32 MB22页128
IC封装资料_电容_0603N560J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129891.26 MB20页35
IC封装资料_电感_SWPA4018S220MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1217361.32 MB22页209
IC封装资料_电感_SWPA6045S5R6MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-121361.32 MB22页257
IC封装资料_电感_SWPA4018S151MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1218721.32 MB22页187
IC封装资料_电源管理芯片_LTC3899IUHF_PBF.pdf
LTC389913899faFormoreinformationwww.linear.com/LTC3899TYPICALAPPLICATIONFEATURESDESCRIPTION60VLowIQ,TripleOutput,Buck/Buck/BoostSy...
2024-12-12649994.13 KB38页289
IC封装资料_电源管理芯片_LTC3406AES5_TRPBF.pdf
LTC3406A13406afaTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTION1.5MHz,600mASynchronousStep-DownRegulatorinThinSOTTheLTC®3406Ais...
2024-12-121515382.92 KB16页12
IC封装资料_电容_CL03C2R2BA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-129911.4 MB36页77
IC封装资料_电容_GRM155R60J155ME80D.pdf
ChipMultilayerCeramicCapacitorsforGeneralPurposeGRM155R60J155ME80_(0402,X5R(EIA),1.5uF,DC6.3V)_:PackagingCodeReferenceSheet■Scope...
2024-12-121600899.99 KB30页136
IC封装资料_电容_0603N561J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-129101.26 MB20页278
IC封装资料_电感_SWPA4018S221MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-121931.32 MB22页55
IC封装资料_电容_CL10A225KQ8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KQ8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1213731.42 MB36页196
IC封装资料_电源管理芯片_LTC3406BES5_TRPBF.pdf
1LTC3406B3406bfa■HighEfficiency:Upto96%■600mAOutputCurrentatVIN=3V■2.5Vto5.5VInputVoltageRange■1.5MHzConstantFrequencyOperatio...
2024-12-12289319.31 KB16页4
IC封装资料_电容_0805B224K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218711.05 MB27页69

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