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IC封装资料_电容_CL03C3R3BA3GNNC.pdf
SPECIFICATIONSupplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CAP,3.3,25V,±0.1,C0G,0201...
2024-12-125341.55 MB36页221
IC封装资料_电容_0603N680G101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-123231.26 MB20页290
IC封装资料_电感_SWPA6045S100MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-128751.32 MB22页179
IC封装资料_电感_SWPA4018S330MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-123041.32 MB22页292
IC封装资料_连接器_1758092.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1254636.13 MB445页80
IC封装资料_电源管理芯片_LTC3406ES5-1.8_TRPBF.pdf
1LTC3406LTC3406-1.5/LTC3406-1.83406fa■HighEfficiency:Upto96%■VeryLowQuiescentCurrent:Only20µADuringOperation■600mAOutputCurren...
2024-12-121471324.31 KB16页257
IC封装资料_电容_GRM21BR71E225KE11L.pdf
GRM21BR71E225KE11_(0805,X7R:EIA,2.2uF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12676916.49 KB29页23
IC封装资料_电容_CL03C8R2CA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-1219191.4 MB36页60
IC封装资料_电容_CL03C3R3CA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-1214941.4 MB36页166
IC封装资料_电容_0603N680J101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1216261.26 MB20页198
IC封装资料_电感_SWPA4018S470MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-121511.32 MB22页225
IC封装资料_电源管理芯片_LTC3407AEDD-2_TRPBF.pdf
LTC3407A-213407a2f■HighEfficiency:Upto95%■LowRipple(<35mVPK-PK)BurstModeOperation;IQ=40μA■2.25MHzConstantFrequencyOperation■N...
2024-12-12258358.76 KB16页120
IC封装资料_电源管理芯片_LTC3407AEDD_TRPBF.pdf
LTC3407A13407afaTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONDualSynchronous600mA,1.5MHzStep-DownDC/DCRegulatorTheLTC®3407Ais...
2024-12-121026371.74 KB16页199
IC封装资料_电容_0603N680J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1210181.26 MB20页232
IC封装资料_电感_SWPA4018S680MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1212501.32 MB22页157
IC封装资料_电容_GRM21BR71H104KA01L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12138110.43 MB296页28
IC封装资料_电源管理芯片_LTC4001EUF_TRPBF.pdf
1LTC40014001f■HandheldBattery-PoweredDevices■HandheldComputers■ChargingDocksandCradles■DigitalCameras■SmartPhones2ASingleCell...
2024-12-12435308.83 KB20页214
IC封装资料_电源管理芯片_LTC4001EUF_PBF.pdf
1LTC40014001f■HandheldBattery-PoweredDevices■HandheldComputers■ChargingDocksandCradles■DigitalCameras■SmartPhones2ASingleCell...
2024-12-121661308.83 KB20页273
IC封装资料_电容_0603N681J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-127301.26 MB20页89
IC封装资料_连接器_1757488.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comFeb25,2010ExtractfromtheonlinecatalogMSTBA2,5/3-GOrderNo.:1757488Thefiguresh...
2024-12-121448230.37 KB5页110

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