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IC封装资料_电容_GRM155R60J224KE01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121126920.26 KB29页239
IC封装资料_连接器_1757475.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comFeb25,2010ExtractfromtheonlinecatalogMSTBA2,5/2-GOrderNo.:1757475Thefiguresh...
2024-12-121062228.93 KB5页58
IC封装资料_电容_CL10A225KQ8NNWC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KQ8NNWC·Product:Multi-layerCeramicCapacitor...
2024-12-126881.45 MB36页131
IC封装资料_电源管理芯片_LTC3407EDD-2_TRPBF.pdf
LTC3407-2134072fcL,LT,LTC,LTM,BurstMode,LinearTechnologyandtheLinearlogoareregisteredtrademarksofLinearTechnologyCorporation.Allot...
2024-12-121410341.53 KB16页195
IC封装资料_电源管理芯片_LTC3407AEMSE-2_TRPBF.pdf
LTC3407A-213407a2f■HighEfficiency:Upto95%■LowRipple(<35mVPK-PK)BurstModeOperation;IQ=40μA■2.25MHzConstantFrequencyOperation■N...
2024-12-12840358.76 KB16页262
IC封装资料_电容_0805B225K250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1219531.05 MB27页66
IC封装资料_电容_CL03C010BB3GNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1217097.46 MB84页155
IC封装资料_电容_0805B225K160NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216651.05 MB27页119
IC封装资料_电感_SWPA6045S102MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-129631.32 MB22页59
IC封装资料_电容_0603N820J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-12941.26 MB20页36
IC封装资料_电感_SWPA6045S101MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-129861.32 MB22页77
IC封装资料_电感_SWPA4020S1R0NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-126861.32 MB22页237
IC封装资料_电容_CL10A225MP8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225MP8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1217261.42 MB36页146
IC封装资料_电感_SWPA4018SR47NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-12651.32 MB22页174
IC封装资料_电源管理芯片_LTC4002EDD-8.4_TRPBF.pdf
LTC400214002f,LTCandLTareregisteredtrademarksofLinearTechnologyCorporation.Allothertrademarksarethepropertyoftheirrespectiveowners...
2024-12-121087253.54 KB16页17
IC封装资料_连接器_1757491.pdf
PHOENIXCONTACTInc.,USAPage1/5http://www.phoenixcon.comFeb25,2010ExtractfromtheonlinecatalogMSTBA2,5/4-GOrderNo.:1757491Thefiguresh...
2024-12-12885229.22 KB5页23
IC封装资料_电源管理芯片_LTC3407EDD-4_TRPBF.pdf
LTC3407-4134074faTYPICALAPPLICATIONFEATURESAPPLICATIONSDESCRIPTIONDualSynchronous,800mA,2.25MHzStep-DownDC/DCRegulatorTheLTC®3407...
2024-12-12412351.33 KB16页114
IC封装资料_电源管理芯片_LTC4002EDD-4.2_TRPBF.pdf
LTC400214002f,LTCandLTareregisteredtrademarksofLinearTechnologyCorporation.Allothertrademarksarethepropertyoftheirrespectiveowners...
2024-12-12721253.54 KB16页242
IC封装资料_电容_0603X105K100CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1217861.26 MB20页185
IC封装资料_电容_CL10A225MQ8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225MQ8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-123611.42 MB36页103

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