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IC封装资料_电容_CL10F104ZB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12191259.58 KB3页281
IC封装资料_电容_CL10F104ZA8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F104ZA8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-12444360.47 KB3页179
IC封装资料_电容_CL10F104ZA8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F104ZA8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-1213471.42 MB36页193
IC封装资料_电容_C3216C0G1H104JT000N.pdf
COM-GEN-006DELIVERYSPECIFICATIONSPEC.No.C-General-fDATE:Aug,2019ToUpontheacceptanceofthisspec.previousspec.(C2011-0454)shallbeabol...
2024-12-1218221.79 MB37页151
IC封装资料_接口及驱动芯片_ISO1042BQDWVRQ1.pdf
1243765TXDVCC1RXDGND1CANHCANL8VCC2MCURXDTXDVDDDGNDDigitalGroundISOGroundCANBusGalvanicIsolationBarrierISO1042-Q1GND2VCC1VCC2Produc...
2024-12-127063.07 MB43页233
IC封装资料_接口及驱动芯片_ICL3232EIA_T.pdf
1ICL3221E,ICL3222E,ICL3223E,ICL3232E,ICL3241E,ICL3243E±15kVESDProtected,+3Vto+5.5V,1µA,250kbps,RS-232Transmitters/ReceiversICL32...
2024-12-1254784.34 KB33页202
IC封装资料_电容_GRM1555C1H470JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121085920.26 KB29页299
IC封装资料_电容_CL10F105ZO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121664259.58 KB3页299
IC封装资料_电容_CL10F104ZO8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12563259.58 KB3页298
IC封装资料_电容_C3216X5R1C476MTJ00N.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-129551.61 MB56页170
IC封装资料_接口及驱动芯片_ISO3082DWR.pdf
12345678910111213141516RREDGND1ncVcc2BAncGND2DEDW�PACKAGEVcc1GND1GND2GND2GND1function�diagramDRBA1312DE6534REGALVANICISOLATIONIS...
2024-12-122781.04 MB20页114
IC封装资料_电容_GRM1555C1H471FA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12626920.26 KB29页99
IC封装资料_电容_CL10F105ZO8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F105ZO8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-124161.42 MB36页224
IC封装资料_电源管理芯片_LTC4415EDHC_TRPBF.pdf
LTC441514415faTypicalapplicaTionFeaTuresDescripTionDual4AIdealDiodeswithAdjustableCurrentLimitTheLTC®4415containstwomonolithicPow...
2024-12-12315435.08 KB20页252
IC封装资料_电容_C3216X5R1E476MTJ00E.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-123531.61 MB56页293
IC封装资料_电源管理芯片_LTC4414EMS8_PBF.pdf
1LTC44144414fc,LT,LTCandLTMareregisteredtrademarksofLinearTechnologyCorporation.PowerPathandThinSOTaretrademarksofLinearTechnology...
2024-12-1290245.13 KB12页74
IC封装资料_连接器_1827910.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12140636.13 MB445页11
IC封装资料_电容_GRM155R61E104KA87D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12639920.26 KB29页35
IC封装资料_电容_CL10B103KB8NFNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-123587.55 MB84页254
IC封装资料_电感_WPN4020H1R5MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121911624.92 KB9页280

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