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IC封装资料_电源管理芯片_LTC4415EMSE_TRPBF.pdf
LTC441514415faTypicalapplicaTionFeaTuresDescripTionDual4AIdealDiodeswithAdjustableCurrentLimitTheLTC®4415containstwomonolithicPow...
2024-12-121590435.08 KB20页298
IC封装资料_电容_CL10B103KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12815259.58 KB3页185
IC封装资料_电容_0805B822K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-128891.26 MB20页248
IC封装资料_电容_0805B821K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210301.05 MB27页108
IC封装资料_接口及驱动芯片_MAX485ESA.pdf
GeneralDescriptionTheMAX481,MAX483,MAX485,MAX487–MAX491,andMAX1487arelow-powertransceiversforRS-485andRS-422communication.Eachpar...
2024-12-121898462.72 KB17页219
IC封装资料_电感_WPN4020H2R2MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-121673624.92 KB9页171
IC封装资料_电容_GRM1555C1H471GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12347920.26 KB29页274
IC封装资料_电源管理芯片_LTC4415IDHC_PBF.pdf
LTC441514415faTypicalapplicaTionFeaTuresDescripTionDual4AIdealDiodeswithAdjustableCurrentLimitTheLTC®4415containstwomonolithicPow...
2024-12-12494435.08 KB20页172
IC封装资料_电容_CL10F105ZP8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F105ZP8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121951360.23 KB3页107
IC封装资料_电容_CL10F105ZP8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121920259.58 KB3页140
IC封装资料_电容_GRM155R61E104MA87D.pdf
GRM155R61E104MA87_(0402,X5R:EIA,0.1uF,DC25V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-121266970.8 KB30页97
IC封装资料_电容_C3216X5R1V226M160AC.pdf
August2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201i...
2024-12-129511.67 MB57页208
IC封装资料_电容_CL10B103KB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B103KB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121241361.14 KB3页239
IC封装资料_接口及驱动芯片_MAX3232ECD.pdf
RXTXPOWER3.3V,5VDINROUTDOUTRS232RINRS2322222ProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&CommunityAnIMPORTANTNOTIC...
2024-12-1215212.43 MB29页28
IC封装资料_电容_CL10B103KB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B103KB8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12886361.13 KB3页72
IC封装资料_电容_CL10F153ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F153ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121978360.21 KB3页85
IC封装资料_接口及驱动芯片_MAX3284EAUT+T.pdf
PinConfigurationsappearatendofdatasheet.GeneralDescriptionTheMAX3280E/MAX3281E/MAX3283E/MAX3284EaresinglereceiversdesignedforRS-48...
2024-12-123781.36 MB11页18
IC封装资料_电容_0805B822K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128241.05 MB27页174
IC封装资料_电容_GRM1555C1H510JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121885920.26 KB29页15
IC封装资料_电感_WPN4020H4R7MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12892624.92 KB9页82

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