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IC封装资料_电容_GRM1555C1H471JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12707920.26 KB29页268
IC封装资料_电感_WPN4020H3R3MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12838624.92 KB9页70
IC封装资料_电容_CL10F154ZO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F154ZO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121240360.68 KB3页4
IC封装资料_电容_CL10F154ZA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F154ZA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-124911.42 MB36页159
IC封装资料_电源管理芯片_LTC4416IMS_PBF.pdf
LTC4416/LTC4416-14416fa36V,LowLossDualPowerPathControllersforLargePFETsTheLTC®4416/LTC4416-1controltwosetsofexternalP-channelMOSF...
2024-12-121182296.71 KB12页287
IC封装资料_电容_C3216X7R1C106K160AC.pdf
August2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201i...
2024-12-1210191.67 MB57页205
IC封装资料_电源管理芯片_LTC4415IMSE_PBF.pdf
LTC441514415faTypicalapplicaTionFeaTuresDescripTionDual4AIdealDiodeswithAdjustableCurrentLimitTheLTC®4415containstwomonolithicPow...
2024-12-121493435.08 KB20页141
IC封装资料_接口及驱动芯片_MAX3295AUT+T.pdf
GeneralDescriptionTheMAX3293/MAX3294/MAX3295low-power,high-speedtransmittersforRS-485/RS-422commu-nicationoperatefromasingle+3.3Vp...
2024-12-1218622.08 MB12页34
IC封装资料_电容_GRM155R61E105KA12D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1274920.26 KB29页218
IC封装资料_电容_GRM1555C1H511JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12661920.26 KB29页165
IC封装资料_电容_CL10B103KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12812452.9 KB21页74
IC封装资料_电容_CL10F223ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F223ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121336360.22 KB3页136
IC封装资料_电容_C3216X7R1E335KT000N.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-122651.61 MB56页159
IC封装资料_电容_0805B823K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1219701.26 MB20页74
IC封装资料_接口及驱动芯片_NXP74VCH2T45.pdf
1.GeneraldescriptionThe74AVCH2T45isadualbit,dualsupplytransceiverthatenablesbidirectionalleveltranslation.Itfeaturestwodatainput-o...
2024-12-12308232.07 KB29页216
IC封装资料_电感_WPN4020H6R8MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12406624.92 KB9页114
IC封装资料_接口及驱动芯片_NXB0104GU12X.pdf
NXB0104Dualsupplytranslatingtransceiver;autodirectionsensing;3-stateRev.1—11September2019Productdatasheet1.GeneraldescriptionTheN...
2024-12-12470422.18 KB25页99
IC封装资料_电容_CL10F224ZA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F224ZA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1216411.42 MB36页102
IC封装资料_电源管理芯片_LTC4417CUF_PBF.pdf
LTC441714417fTypicalapplicaTionFeaTuresDescripTionPrioritizedPowerPath™ControllerTheLTC®4417connectsoneofthreevalidpowersupplies...
2024-12-121271515.8 KB32页155
IC封装资料_电容_C3216X7S2A225KT000N.pdf
COM-GEN-006DELIVERYSPECIFICATIONSPEC.No.C-General-fDATE:Aug,2019ToUpontheacceptanceofthisspec.previousspec.(C2011-0454)shallbeabol...
2024-12-121781.79 MB37页68

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