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IC封装资料_连接器_1759075.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12165436.13 MB445页92
IC封装资料_连接器_1844210.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/2-G-3,5OrderNo.:1844210...
2024-12-12613246.93 KB5页60
IC封装资料_电容_GRM1885C1H240JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12972944.07 KB30页86
IC封装资料_电容_CL21C101JCANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213061.45 MB36页205
IC封装资料_连接器_1844249.pdf
https://www.phoenixcontact.com/pi/products/184424904/09/2019Page1/4Feed-throughheader-MC1,5/5-G-3,5-1844249Pleasebeinformedthatthe...
2024-12-121053249.83 KB4页250
IC封装资料_连接器_1844236.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/4-G-3,5OrderNo.:1844236...
2024-12-121032246.82 KB5页157
IC封装资料_连接器_1844223.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/3-G-3,5OrderNo.:1844223...
2024-12-12744246.58 KB5页157
IC封装资料_电容_GRM1885C1H241JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121255944.07 KB30页145
IC封装资料_电容_CL21C102JBCNNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-125321.45 MB36页13
IC封装资料_连接器_1844294.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/10-G-3,5OrderNo.:184429...
2024-12-121119246.9 KB5页160
IC封装资料_连接器_1844281.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/9-G-3,5OrderNo.:1844281...
2024-12-121255246.95 KB5页66
IC封装资料_连接器_1844278.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/8-G-3,5OrderNo.:1844278...
2024-12-121294246.95 KB5页47
IC封装资料_连接器_1844265.pdf
https://www.phoenixcontact.com/us/products/184426504/26/2016Page1/10Basestrip-MC1,5/7-G-3,5-1844265Pleasebeinformedthatthedatashow...
2024-12-12576354.84 KB11页131
IC封装资料_连接器_1844252.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/6-G-3,5OrderNo.:1844252...
2024-12-121192246.86 KB5页99
IC封装资料_电容_GRM1885C1H270FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12822944.07 KB30页298
IC封装资料_电容_GRM1885C1H242JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121793944.07 KB30页135
IC封装资料_电容_CL21C121JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12228316.31 KB3页96
IC封装资料_电容_CL21C120JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B472KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-122951.45 MB36页160
IC封装资料_电源管理芯片_MIC5247-1.8YM5-TR.pdf
MIC5247Micrel,Inc.February20061M9999-022406GeneralDescriptionTheMIC5247isanefficientandprecise,low-voltageCMOSvoltageregulatoropti...
2024-12-12737411.8 KB12页169
IC封装资料_电容_CL21C103JBFNNNE.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-126461.39 MB36页103

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