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IC封装资料_电源管理芯片_MIC5225-3.3YM5-TR.pdf
MIC5225Ultra-LowQuiescentCurrent150mAµCapLowDropoutRegulatorIttyBittyisaregisteredtrademarkofMicrel,Inc.MicrelInc.•2180FortuneDr...
2024-12-12969303.18 KB9页101
IC封装资料_连接器_1844317.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/12-G-3,5OrderNo.:184431...
2024-12-12937247.03 KB5页64
IC封装资料_电容_GRM155R71H153KA12D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121187920.26 KB29页69
IC封装资料_连接器_1844304.pdf
https://www.phoenixcontact.com/us/produkte/184430410.10.2012Page1/6Basestrip-MC1,5/11-G-3,5-1844304Pleasebeinformedthatthedatashow...
2024-12-12154188.72 KB6页78
IC封装资料_电容_CL21C151JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-122161.45 MB36页22
IC封装资料_电容_CL10B201KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B201KB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121614361.44 KB3页286
IC封装资料_电容_CL21C150JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-128101.45 MB36页41
IC封装资料_电容_CL10B183KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B183KB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12561361.12 KB3页299
IC封装资料_连接器_1844320.pdf
https://www.phoenixcontact.com/us/produkte/184432011.10.2012Page1/6Basestrip-MC1,5/13-G-3,5-1844320Pleasebeinformedthatthedatashow...
2024-12-12801188.78 KB6页146
IC封装资料_电容_0805F223M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126351.05 MB27页159
IC封装资料_电容_GRM1885C1H270GA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12288944.07 KB30页129
IC封装资料_连接器_1881464.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC0,5/4-G-2,5OrderNo.:1881464...
2024-12-12982251.47 KB5页53
IC封装资料_电感_YNR5040-681M.pdf
SMDPowerInductors-YNR5040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-1251666.66 KB5页205
IC封装资料_连接器_1881451.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC0,5/3-G-2,5OrderNo.:1881451...
2024-12-1275251.51 KB5页155
IC封装资料_连接器_1844359.pdf
https://www.phoenixcontact.com/us/produkte/184435902.11.2012Page1/6Basestrip-MC1,5/16-G-3,5-1844359Pleasebeinformedthatthedatashow...
2024-12-12918190.69 KB6页259
IC封装资料_电源管理芯片_MIC5256-3.3YM5-TR.pdf
MIC5256150mAµCapLDOwithErrorFlagIttyBittyisaregisteredtrademarkofMicrel,Inc.MicrelInc.•2180FortuneDrive•SanJose,CA95131•USA•t...
2024-12-12424631.76 KB13页214
IC封装资料_连接器_1844346.pdf
https://www.phoenixcontact.com/pi/products/184434604/09/2019Page1/4Feed-throughheader-MC1,5/15-G-3,5-1844346Pleasebeinformedthatth...
2024-12-12177240.02 KB4页61
IC封装资料_电容_GRM155R71H182JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121983920.26 KB29页130
IC封装资料_连接器_1844333.pdf
https://www.phoenixcontact.com/us/produkte/184433302.11.2012Page1/6Basestrip-MC1,5/14-G-3,5-1844333Pleasebeinformedthatthedatashow...
2024-12-121976190.53 KB6页192
IC封装资料_电容_GRM1885C1H271GA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12876944.07 KB30页275

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