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IC封装资料_电容_CL10B203KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12611259.58 KB3页37
IC封装资料_电容_GRM1885C1H270JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121415944.07 KB30页21
IC封装资料_电容_CL10B202KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121876259.58 KB3页36
IC封装资料_电容_CL21C152JBFNNNE.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1214377.46 MB84页203
IC封装资料_电容_0805F225M250NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125781.05 MB27页269
IC封装资料_电容_0805F224M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-127141.05 MB27页217
IC封装资料_连接器_1881493.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC0,5/7-G-2,5OrderNo.:1881493...
2024-12-121197251.43 KB5页35
IC封装资料_连接器_1881480.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC0,5/6-G-2,5OrderNo.:1881480...
2024-12-121516251.5 KB5页197
IC封装资料_电感_YNR6045-1R5M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121009672.55 KB6页112
IC封装资料_连接器_1881477.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC0,5/5-G-2,5OrderNo.:1881477...
2024-12-121735251.25 KB5页36
IC封装资料_电感_YNR6045-1R0M.pdf
SMDPowerInductors-YNR6045Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12937672.55 KB6页110
IC封装资料_电容_CL21C221JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215691.45 MB36页73
IC封装资料_电源管理芯片_MIC5365-1.2YC5-TR.pdf
LP5951VINOUTGNDNCINEnableControl,activehigh13245LoadEN1�F1�FProductFolderSample&BuyTechnicalDocumentsTools&SoftwareSupport&Commu...
2024-12-1211261.31 MB27页267
IC封装资料_电容_CL21C200JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-128381.45 MB36页30
IC封装资料_连接器_1881516.pdf
https://www.phoenixcontact.com/us/produkte/188151603.10.2012Page1/5Basestrip-MC0.5/9-G-2.5-1881516Pleasebeinformedthatthedatashown...
2024-12-121878181.57 KB5页243
IC封装资料_电容_GRM155R71H182KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12894920.26 KB29页265
IC封装资料_连接器_1881503.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC0,5/8-G-2,5OrderNo.:1881503...
2024-12-121528251.58 KB5页153
IC封装资料_电容_GRM1885C1H271JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121318944.07 KB30页151
IC封装资料_电容_CL10B221JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B221JB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121929360.94 KB3页37
IC封装资料_电容_CL21C221JCANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-122341.39 MB36页8

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