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IC封装资料_电阻_RN14W10KFTBA1.pdf
21ReferenceStandardsIEC60115-1JISC5201-1RNseriesPRECISIONMETALFILMRESISTORSELECTRICALANDMECHANICALPERFORMANCEENVIRONMENTALCHARACTE...
2024-12-121782497.45 KB2页290
IC封装资料_电容_GRM1555C1H160GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121551920.26 KB29页192
IC封装资料_电容_0805B472K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210021.05 MB27页17
IC封装资料_电容_CL10C511JB81PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12582452.9 KB21页264
IC封装资料_电容_CL10C511JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12653316.3 KB3页22
IC封装资料_电感_SWPA252010S3R3MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-125941.32 MB22页34
IC封装资料_电容_C1005NP0120JGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-121461.92 MB48页10
IC封装资料_电容_C1005C0G1H330F050BA.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[020...
2024-12-129601.65 MB57页291
IC封装资料_连接器_1758128.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12167836.13 MB445页251
IC封装资料_连接器_1806326.pdf
https://www.phoenixcontact.com/us/products/180632610/27/2014Page1/5Housing-GMSTB2,5/12-GF-7,62-1806326Pleasebeinformedthatthedatas...
2024-12-12255169.28 KB5页4
IC封装资料_连接器_1806313.pdf
https://www.phoenixcontact.com/us/products/180631310/27/2014Page1/5Basestrip-GMSTB2,5/11-GF-7,62-1806313Pleasebeinformedthatthedat...
2024-12-121029169.27 KB5页253
IC封装资料_电阻_SDV1608S5R5C050YPTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2015/04/10SunlordIndustrialPark,Dafuyu...
2024-12-121009339.82 KB10页98
IC封装资料_电阻_SDV1005S5R5C030YPTF.pdf
Specificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2015/04/10SunlordIndustrialPark,Dafuyu...
2024-12-121699339.83 KB10页220
IC封装资料_电容_GRM1555C1H160JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121259920.26 KB29页216
IC封装资料_电容_CL10C560JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-1215201.39 MB36页99
IC封装资料_电容_CL10C560FB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121505316.17 KB3页95
IC封装资料_电容_C1005NP0200JGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-129781.92 MB48页4
IC封装资料_电阻_SFI0805ML080C-LF.pdf
PartNo.SFI0805ML080C-LFDocumentNo.AS-RD0805MC091-LFREV.Khttp://www.sfi.com.twE-mail:sfi@sfi.com.twTEL:886-3-3506998FAX:886-3-35076...
2024-12-121932670.66 KB7页66
IC封装资料_电阻_SFI0402-120E100NP-LF.pdf
PartNo.SFI0402-120E100NP-LFDocumentNo.AS-RD0402ME062-LFREV.Ihttp://www.sfi.com.twE-mail:sfi@sfi.com.twTEL:886-3-3506998FAX:886-3-3...
2024-12-12727615.1 KB7页146
IC封装资料_电容_GRM1555C1H161JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12969920.26 KB29页6

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