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IC封装资料_电阻_VCAS120618E380RP.pdf
14012317TransGuard®AutomotiveSeriesMultilayerVaristorsforAutomotiveApplicationsGENERALDESCRIPTIONTheTransGuardAutomotiveSeriesare...
2024-12-12195679.63 KB10页98
IC封装资料_电阻_TVR14471KSY.pdf
氧化锌压敏电阻器：TVR系列浪涌保护用插件型兴勤电子工业股份有限公司8www.thinking.com.tw2018.12产品规格与数据若有变更，恕不另行通知...
2024-12-127561.32 MB30页271
IC封装资料_电容_CL10B102JA8NNNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121435452.9 KB21页226
IC封装资料_电容_GRM1555C1H180FA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121007920.26 KB29页98
IC封装资料_电感_SWPA252010S4R7MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1213521.32 MB22页76
IC封装资料_电容_CL10C560KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12233316.51 KB3页36
IC封装资料_电容_CL10C560JB81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12711259.58 KB3页298
IC封装资料_电容_CL10C560JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12838316.29 KB3页222
IC封装资料_电源管理芯片_LTC4267IGN-3_TRPBF.pdf
LTC4267-3142673fbFormoreinformationwww.linear.com/LTC4267-3PoweroverEthernetIEEE802.3afPDInterfacewithIntegratedSwitchingRegulator...
2024-12-121172473.89 KB34页237
IC封装资料_电源管理芯片_LTC4267IDHC-3_TRPBF.pdf
LTC4267-3142673fbFormoreinformationwww.linear.com/LTC4267-3PoweroverEthernetIEEE802.3afPDInterfacewithIntegratedSwitchingRegulator...
2024-12-12465473.89 KB34页161
IC封装资料_电容_CL10C560JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12533259.58 KB3页258
IC封装资料_电容_C1005NP0509CGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-1211311.92 MB48页275
IC封装资料_电容_GRM155R61A334KE15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121762920.26 KB29页173
IC封装资料_电阻_YC124-JR-0710KL.pdf
120DATASHEETARRAYCHIPRESISTORSYC/TC5%,1%sizesYC:102/104/122/124/162/164/248/324/158/358TC:122/124/164RoHScompliantProductspecifica...
2024-12-121495868.82 KB12页253
IC封装资料_电容_CL10B102JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121476259.58 KB3页19
IC封装资料_电阻_WA04X220JTL.pdf
ApprovalsheetPage1of9ASC_WA04/06_V15Oct.2010WA04,WA06±±±±1%,±±±±5%,ConvexType&ConcaveTypeGeneralpurposechipresistorsarrayS...
2024-12-121715678.52 KB9页99
IC封装资料_电容_CL10B102JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B102JB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1218261.45 MB36页289
IC封装资料_电阻_VZ067TH1B105.pdf
ProductNameModelNo.ControlNo.DateSalesRepresentativeApprovedApprovedＳＰＥＣＩＦＩＣＡＴＩＯＮHOKURIKUELECTRICINDUSTRYCO.,LTD.Thec...
2024-12-121366248.17 KB13页90
IC封装资料_电容_GRM1555C1H180JA01D.pdf
GRM1555C1H180JA01_(0402,C0G:EIA,18pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121032944.29 KB30页203
IC封装资料_电容_GRM1555C1H180GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121425920.26 KB29页257

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