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IC封装资料_电容_GRM1555C1H200JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121384920.26 KB29页206
IC封装资料_电容_CL10C621JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12868259.58 KB3页13
IC封装资料_电源管理芯片_LTC4353CMS_PBF.pdf
LTC435314353fTypicalapplicaTionFeaTuresDescripTionDualLowVoltageIdealDiodeControllerTheLTC®4353controlsexternalN-channelMOSFETsto...
2024-12-121239325.02 KB16页299
IC封装资料_电容_CL10C620JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12617316.27 KB3页171
IC封装资料_电源管理芯片_LTC4352IMS_TRPBF.pdf
LTC435214352faTypicalapplicaTionDescripTionLowVoltageIdealDiodeControllerwithMonitoringTheLTC®4352createsanear-idealdiodeusingane...
2024-12-12993307.26 KB16页40
IC封装资料_电容_C1005X7R104KETS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-128361.92 MB48页116
IC封装资料_电容_GRM155R61A475MEAAD.pdf
GRM155R61A475MEAA_(0402,X5R:EIA,4.7uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12685944.57 KB30页133
IC封装资料_二极管_NSR0230P2T5G.pdf
©SemiconductorComponentsIndustries,LLC,2013September,2019−Rev.31PublicationOrderNumber:NSR0230P2/DSchottkyBarrierDiodeNSR0230P2T...
2024-12-12719316.9 KB4页275
IC封装资料_电容_CL10B102KB8NNWC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121673452.9 KB21页9
IC封装资料_电容_GRM1555C1H220FA01D.pdf
GRM1555C1H220FA01_(0402,C0G:EIA,22pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-12326947.48 KB30页293
IC封装资料_电容_CL10B102KB8NNNL.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B102KB8NNNL·Product:Multi-layerCeramicCapacitor...
2024-12-121968334.92 KB3页296
IC封装资料_电容_CL10C680GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12781316.17 KB3页235
IC封装资料_电容_0805B474K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-121271.05 MB27页11
IC封装资料_电容_CL10C680FB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121323259.57 KB3页85
IC封装资料_电容_C1005X7R223KFTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-1211451.92 MB48页281
IC封装资料_电感_SWPA252012S3R3MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211871.32 MB22页280
IC封装资料_非易失性存储器_GD5F1GQ4RB9IGR.pdf
SPI(x1/x2/x4)NANDFlash1G1GD5F1GQ4xBxIGDATASHEET更多资料下载请到五八文库wk.58sms.comSPI(x1/x2/x4)NANDFlash1G2Contents1FEATURE.........
2024-12-121751.42 MB50页169
IC封装资料_电源管理芯片_LTC4355CDE_TRPBF.pdf
LTC435514355ffFormoreinformationwww.linear.com/LTC4355FeaturesapplicationsDescriptionPositiveHighVoltageIdealDiode-ORwithInputSupp...
2024-12-121315317.96 KB20页227
IC封装资料_电容_GRM1555C1H220GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121929920.26 KB29页154
IC封装资料_电源管理芯片_LTC4355CS_TRPBF.pdf
LTC435514355ffFormoreinformationwww.linear.com/LTC4355FeaturesapplicationsDescriptionPositiveHighVoltageIdealDiode-ORwithInputSupp...
2024-12-121695317.96 KB20页107

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