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IC封装资料_电容_GRM155R61A824KE15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121736920.26 KB29页78
IC封装资料_非易失性存储器_MX25U25635FMI10G.pdf
MX25U25635FP/N:PM1712MX25U25635FDATASHEET更多资料下载请到五八文库wk.58sms.com2MX25U25635FREV.1.2,NOV.28,2013P/N:PM1712Contents1.FE...
2024-12-1218281.5 MB96页124
IC封装资料_电容_0805B511K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1214651.05 MB27页244
IC封装资料_电容_GRM1555C1H221JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121891920.26 KB29页252
IC封装资料_电容_0805B502K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218911.05 MB27页155
IC封装资料_电容_GRM1555C1H221GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12874920.26 KB29页258
IC封装资料_电容_CL10C680JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12262316.29 KB3页203
IC封装资料_电感_SWPA252012S100MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1216181.32 MB22页93
IC封装资料_电容_C1210C222KDRACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1010_X7R_HV_SMD•11/9/2018FortLauderdale,FL33301USA•954-766-2...
2024-12-1217741.42 MB22页139
IC封装资料_电感_SWPA252012S6R8MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1212961.32 MB22页241
IC封装资料_电容_C1210C221JGGACTU.pdf
©KEMETElectronicsCorporation•P.O.Box5928•Greenville,SC29606•864-963-6300•www.kemet.comC1009_C0G_HV_SMD•6/8/20181Oneworld.One...
2024-12-129841.41 MB23页127
IC封装资料_电容_CL10C680JB81PNC.pdf
●Supplier:Samsungelectro-mechanicsCL10C680JB81PNC●Product:Multi-layerCeramicCapacitorCAP,68㎊,50V,±5%,C0G,0603●AEC-Q200Qualifi...
2024-12-125475.8 MB36页24
IC封装资料_电源管理芯片_LTC4357HMS8_PBF.pdf
LTC43574357fdFeaturesapplicationsDescriptionPositiveHighVoltageIdealDiodeControllerTheLTC®4357isapositivehighvoltageidealdiodecon...
2024-12-121085840.98 KB14页250
IC封装资料_电源管理芯片_LTC4357CMS8_TRPBF.pdf
LTC43574357fdFeaturesapplicationsDescriptionPositiveHighVoltageIdealDiodeControllerTheLTC®4357isapositivehighvoltageidealdiodecon...
2024-12-12264840.98 KB14页247
IC封装资料_电容_C1608C0G1E822J080AA.pdf
SeriesNameCaseSizeCodeTemperatureCharacteristicsRatedVoltageCodeCapacitanceToleranceThicknessCodePackagingCodeSpecialCodeDescripti...
2024-12-121147463.62 KB3页178
IC封装资料_电容_GRM155R61C104KA88D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12455920.26 KB29页160
IC封装资料_电容_CL10B102KB8WPNL.pdf
●Supplier:SamsungElectro-MechanicsCL10B102KB8WPNL●Product:Multi-layerCeramicCapacitorCAP,1㎋,50V,±10%,X7R,0603●AEC-Q200Qualifi...
2024-12-121553269.04 KB3页119
IC封装资料_光电器件_EL357N_B__TA_-G.pdf
4PINULTRASMALLSOPPHOTOTRANSISTORPHOTOCOUPLEREverlightElectronicsCo.,Ltd.1http://www.everlight.comDocumentNo：DPC-0000014Rev.4Decem...
2024-12-121137971.42 KB11页251
IC封装资料_电容_0805B512K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1210021.05 MB27页166
IC封装资料_非易失性存储器_N25Q128A13BF840F.pdf
February2010Rev1.01/1851N25Q128128-Mbit,1.8V,multipleI/O,4-Kbytesubsectoreraseonbootsectors,XiPenabled,serialflashmemorywith108MHz...
2024-12-128495.82 MB185页226

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