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IC封装资料_晶振_7XZ.pdf
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2024-12-124211.18 MB1页216
IC封装资料_电感_WPN252010H1R5MT.pdf
TheSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2016/07/21SunlordIndustrialPark,Daf...
2024-12-12453624.92 KB9页34
IC封装资料_连接器_1758157.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12152636.13 MB445页140
IC封装资料_电容_GRM1555C1H680GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121758920.26 KB29页20
IC封装资料_电容_CL10F474ZO8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F474ZO8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1217401.42 MB36页165
IC封装资料_电容_CL10F474ZB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12257259.57 KB3页250
IC封装资料_电容_CL10F474ZA8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F474ZA8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-121765360.62 KB3页205
IC封装资料_电容_CC0201CRNPO9BN1R2.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-124321.22 MB13页82
IC封装资料_晶振_NX3225SA.pdf
Whenorderingourproducts,specifythemwithan“OrderingCode”thatconsistsofthefollowing:--MIfyouhaveanyqueriesconcerningourstandardfre...
2024-12-121092184.82 KB2页15
IC封装资料_晶振_DSX321G.pdf
DSX221G13～16MHz150Ωmax.16～20MHzFundamentalSeries,8pF,10pF,12pF10μW（200μWmax.）±10×10－6,±20×10－6,±30×10－6,±50×10－...
2024-12-121174289.75 KB1页204
IC封装资料_开关_K2-1107ST-A4SW-06.pdf
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2024-12-12782156.34 KB1页147
IC封装资料_电容_GRM1555C1H680JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12690920.26 KB29页134
IC封装资料_电容_CL10F683ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F683ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-121015360.2 KB3页229
IC封装资料_电容_CC0201CRNPO9BN1R5.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-121121.22 MB13页53
IC封装资料_锂电池专用芯片_LP4056HSPF.pdf
AEN(seeNoteA)BChargePumpVCCD−D+1D−1D+2D−2D+SOEDigitalControlProductFolderOrderNowTechnicalDocumentsTools&SoftwareSupport&Commun...
2024-12-122402.65 MB30页225
IC封装资料_开关_ST-1187.pdf
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2024-12-121915914.08 KB8页45
IC封装资料_电容_GRM1555C1H681JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121173920.26 KB29页58
IC封装资料_电容_CL10X106MO8NRNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10X106MO8NRNC·Product:Multi-layerCeramicCapacitor...
2024-12-1210981.28 MB36页142
IC封装资料_电源管理芯片_LTC6655CHMS8-5_PBF.pdf
LTC6655/LTC6655LN1Rev.GFormoreinformationwww.analog.comTYPICALAPPLICATIONDESCRIPTION0.25ppmNoise,LowDriftPrecisionReferencesTheLTC...
2024-12-1211592.42 MB30页203
IC封装资料_电容_CL10F823ZB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10F823ZB8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12897360.21 KB3页236

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