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IC封装资料_电容_CL10B182KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121808259.57 KB3页250
IC封装资料_电容_0805F123M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126861.05 MB27页261
IC封装资料_连接器_1843839.pdf
https://www.phoenixcontact.com/us/produkte/184383919.10.2012Page1/7Basestrip-MC1,5/6-GF-3,5-1843839Pleasebeinformedthatthedatashow...
2024-12-121458270.13 KB7页215
IC封装资料_电感_YNR5040-331M.pdf
SMDPowerInductors-YNR5040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121320666.66 KB5页277
IC封装资料_连接器_1843813.pdf
https://www.phoenixcontact.com/us/produkte/184381321.12.2012Page1/7Basestrip-MC1,5/4-GF-3,5-1843813Pleasebeinformedthatthedatashow...
2024-12-121840272.14 KB7页166
IC封装资料_电容_CL21C080CBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-125991.45 MB36页147
IC封装资料_连接器_1843897.pdf
https://www.phoenixcontact.com/us/produkte/184389726.10.2012Page1/6Basestrip-MC1.5/12-GF-3.5-1843897Pleasebeinformedthatthedatasho...
2024-12-121425184.76 KB6页138
IC封装资料_电源管理芯片_MIC5205-3.3YM5-TR.pdf
2017MicrochipTechnologyInc.DS20005785A-page1MIC5205Features•Ultra-LowNoiseOutput•HighOutputVoltageAccuracy•Guaranteed150mAOut...
2024-12-128671.39 MB20页278
IC封装资料_电源管理芯片_MIC803-31D4VM3-TR.pdf
MIC8033-PinMicroprocessorSupervisorCircuitwithOpen-DrainResetOutputMicrelInc.•2180FortuneDrive•SanJose,CA95131•USA•tel+1(408)9...
2024-12-12367670.63 KB12页47
IC封装资料_连接器_1843855.pdf
https://www.phoenixcontact.com/us/produkte/184385521.12.2012Page1/7Basestrip-MC1,5/8-GF-3,5-1843855Pleasebeinformedthatthedatashow...
2024-12-12214272.09 KB7页85
IC封装资料_电容_CL10B183KA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B183KA8NNNC·Product:Multi-layerCeramicCapacitor...
2024-12-12926361.47 KB3页117
IC封装资料_电容_GRM1885C1H222FA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12617944.07 KB30页89
IC封装资料_电容_GRM1885C1H221JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12177944.07 KB30页214
IC封装资料_电容_0805F153M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-122271.05 MB27页78
IC封装资料_电容_CL21C100DBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-123731.45 MB36页210
IC封装资料_电容_CL21C080DBANNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-1217247.46 MB84页242
IC封装资料_电容_0805F124M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1213791.05 MB27页89
IC封装资料_电感_YNR5040-470M.pdf
SMDPowerInductors-YNR5040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121927666.66 KB5页199
IC封装资料_电感_YNR5040-332M.pdf
SMDPowerInductors-YNR5040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121196666.66 KB5页300
IC封装资料_电容_CC0402JRNPO9BN101P.pdf
ProductSpecification–January18,2017V.9DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORS01005NP0/X5R/X7R4VTO16V0.5pFto220nFRoHScom...
2024-12-12474998.46 KB11页176

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