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IC封装资料_连接器_1843923.pdf
https://www.phoenixcontact.com/us/products/184392304/23/2016Page1/7Basestrip-MC1,5/15-GF-3,5-1843923Pleasebeinformedthatthedatasho...
2024-12-12250234.04 KB8页77
IC封装资料_电源管理芯片_MIC5219-3.3YM5-TR.pdf
DS20006021A-page12018MicrochipTechnologyInc.MIC5219Features•500mAOutputCurrentCapability-SOT23-5Package-500mAPeak-2mmx2mmx0.9mm...
2024-12-1219681.24 MB32页159
IC封装资料_连接器_1843910.pdf
https://www.phoenixcontact.com/pi/products/184391004/09/2019Page1/4Feed-throughheader-MC1,5/14-GF-3,5-1843910Pleasebeinformedthatt...
2024-12-12100218.22 KB4页90
IC封装资料_连接器_1843907.pdf
https://www.phoenixcontact.com/us/products/184390710/28/2014Page1/5Basestrip-MC1,5/13-GF-3,5-1843907Pleasebeinformedthatthedatasho...
2024-12-121094175.34 KB5页274
IC封装资料_电容_GRM155R71H152KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1251920.26 KB29页107
IC封装资料_电容_CL10B183KB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B183KB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1214051.45 MB36页42
IC封装资料_电容_GRM1885C1H222JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-121015944.07 KB30页179
IC封装资料_电容_0805F183M500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-124621.05 MB27页227
IC封装资料_电容_CL21C100JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B472KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-126161.45 MB36页17
IC封装资料_电感_YNR5040-680M.pdf
SMDPowerInductors-YNR5040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-12921666.66 KB5页153
IC封装资料_电容_CC0402JRNPO9BN102.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1210561.22 MB13页117
IC封装资料_连接器_1843936.pdf
https://www.phoenixcontact.com/us/produkte/184393605.10.2012Page1/6Basestrip-MC1,5/16-GF-3,5-1843936Pleasebeinformedthatthedatasho...
2024-12-121375183.16 KB6页34
IC封装资料_电容_CL21C101JBANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B222KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1219451.45 MB36页44
IC封装资料_电感_YNR5040-471M.pdf
SMDPowerInductors-YNR5040Series深圳市益嘉源电子有限公司Tel:0755-27803896Fax:0755-27803897http://www.yjycoin.com-1-■Features●Lowp...
2024-12-121723666.66 KB5页114
IC封装资料_连接器_1759075.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12165436.13 MB445页92
IC封装资料_电容_CC0402JRNPO9BN121.pdf
ProductSpecification–July13,2018V.11DATASHEETSURFACE-MOUNTCERAMICMULTILAYERCAPACITORSHigh-VoltageNP0/X7R1KVTO3KV10pFto33nFRoHScom...
2024-12-1219291.22 MB13页251
IC封装资料_连接器_1844210.pdf
PHOENIXCONTACTDeutschlandGmbHPage1/5http://www.phoenixcontact.deMar11,2010ExtractfromtheonlinecatalogMC1,5/2-G-3,5OrderNo.:1844210...
2024-12-12614246.93 KB5页60
IC封装资料_电容_GRM1885C1H240JA01D.pdf
GRM1885C1H182JA01_(0603,C0G:EIA,1800pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:...
2024-12-12973944.07 KB30页86
IC封装资料_电容_CL21C101JCANNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL21B332KBANNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1213071.45 MB36页205
IC封装资料_连接器_1844249.pdf
https://www.phoenixcontact.com/pi/products/184424904/09/2019Page1/4Feed-throughheader-MC1,5/5-G-3,5-1844249Pleasebeinformedthatthe...
2024-12-121053249.83 KB4页250

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