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IC资料

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IC封装资料_电容_CL10A224KA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121750259.58 KB3页48
IC封装资料_电容_GRM21BR61E226ME44L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-1288510.43 MB296页44
IC封装资料_电容_0805B221K501CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126601.26 MB20页187
IC封装资料_电感_SWPA6028S220MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1216501.32 MB22页62
IC封装资料_连接器_1758089.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12181936.13 MB445页13
IC封装资料_电容_CL03A473KQ3NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL03A225MQ3CRNC·Product:Multi-layerCeramicCapacitor...
2024-12-121611.42 MB36页32
IC封装资料_电容_0603N221J101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-128741.26 MB20页45
IC封装资料_电容_0603N220J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-127661.26 MB20页130
IC封装资料_电感_SWPA3015S470MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-129211.32 MB22页183
IC封装资料_电容_CL03B102KA3NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL03A225MQ3CRNC·Product:Multi-layerCeramicCapacitor...
2024-12-129651.42 MB36页170
IC封装资料_电容_0603N221J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-12881.26 MB20页268
IC封装资料_电感_SWPA4012S1R0NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1212481.32 MB22页1
IC封装资料_电感_SWPA3015S680MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-121161.32 MB22页26
IC封装资料_连接器_1757378.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12148036.13 MB445页148
IC封装资料_电源管理芯片_LTC3869EUFD_TRPBF.pdf
LTC3869/LTC3869-2138692fbFormoreinformationwww.linear.com/LTC3869TypicalapplicaTionDescripTionDual,2-PhaseSynchronousStep-DownDC/D...
2024-12-12871754.69 KB44页89
IC封装资料_电容_CL10A224KB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121682259.57 KB3页195
IC封装资料_电容_0805B221K501T.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1218631.05 MB27页95
IC封装资料_电感_SWPA6028S330MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1218581.32 MB22页46
IC封装资料_电容_GRM155C80J225KE95D.pdf
Lsize1.0±0.05mmWsize0.5±0.05mmTsize0.5±0.05mmExternalterminalwidthe0.15to0.35mmDistancebetweenexternalterminalsg0.3mmmin.Sizeco...
2024-12-1219873.22 MB2页92
IC封装资料_电源管理芯片_LTC3129EMSE_TRPBF.pdf
LTC312913129fcFormoreinformationwww.linear.com/LTC3129TypicalapplicaTionFeaTuresDescripTion15V,200mASynchronousBuck-BoostDC/DCConv...
2024-12-1219761.56 MB30页87

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