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IC资料

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IC封装资料_电容_GRM155R6YA224KE01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12382920.26 KB29页152
IC封装资料_电容_CL03C0R5BA3GNNC.pdf
SPECIFICATION(Referencesheet)Supplier:Samsungelectro-mechanicsSamsungP/N:Product:Multi-layerCeramicCapacitorDescription:CA...
2024-12-121600355.35 KB3页283
IC封装资料_电容_0603N271J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1217291.26 MB20页95
IC封装资料_电容_CL10A225KO5LNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A225KO5LNNC·Product:Multi-layerCeramicCapacitor...
2024-12-1215981.45 MB36页138
IC封装资料_电感_SWPA4012S4R7NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1219801.32 MB22页297
IC封装资料_电容_0603N300J500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1211541.26 MB20页201
IC封装资料_电容_CL10A225KL8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12504259.58 KB3页227
IC封装资料_电感_SWPA4012S6R8MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1213991.32 MB22页38
IC封装资料_电容_0805B222K251CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126201.26 MB20页125
IC封装资料_电源管理芯片_LTC3200EMS8_TRPBF.pdf
LTC3200/LTC3200-51APPLICATIOSUDESCRIPTIOUFEATURESTYPICALAPPLICATIOUTheLTC®3200/LTC3200-5arelownoise,constantfre-quencyswitchedcap...
2024-12-12900263.11 KB12页151
IC封装资料_电感_SWPA6040S150MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1217071.32 MB22页216
IC封装资料_电感_SWPA4012S100MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1212031.32 MB22页113
IC封装资料_电源管理芯片_LTC3204EDC-5_TRMPBF.pdf
LTC3204-3.3/LTC3204-5/LTC3204B-3.3/LTC3204B-513204faFEATURESDESCRIPTIOUTYPICALAPPLICATIOUTheLTC®3204-3.3/LTC3204-5/LTC3204B-3.3/L...
2024-12-12743709.93 KB12页288
IC封装资料_电源管理芯片_LTC3200ES6-5_TRPBF.pdf
LTC3200/LTC3200-51APPLICATIOSUDESCRIPTIOUFEATURESTYPICALAPPLICATIOUTheLTC®3200/LTC3200-5arelownoise,constantfre-quencyswitchedcap...
2024-12-121976263.11 KB12页24
IC封装资料_电感_SWPA6040S100MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-129721.32 MB22页73
IC封装资料_电容_GRM21BR61H225KA73L.pdf
ChipMultilayerCeramicCapacitorsforGeneral2018C02E.pdfNov.27,2017更多资料下载请到五八文库wk.58sms.comC02E.pdfNov.27,2017!Note•Plea...
2024-12-12125510.43 MB296页255
IC封装资料_电源管理芯片_LTC3878EGN_TRPBF.pdf
LTC38783878faTypicalapplicaTionFeaTuresapplicaTionsDescripTionFast,WideOperatingRangeNoRSENSEStep-DownDC/DCControllernDistributedP...
2024-12-12238487.08 KB26页280
IC封装资料_电源管理芯片_LTC3872ETS8_TRPBF.pdf
LTC387213872fcFormoreinformationwww.linear.com/LTC3872NoRSENSECurrentModeBoostDC/DCControllerHighEfficiency3.3VInput,5VOutputBoost...
2024-12-121736339.95 KB22页169
IC封装资料_电容_GRM155R6YA474KE01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12429920.26 KB29页36
IC封装资料_电容_CL03C0R6CA3GNNC.pdf
November20151.86gMLCC(02A104M)1pieceCarbonEmission更多资料下载请到五八文库wk.58sms.com1.86gMLCC(02A104M)1piece1.86gCarbonEmissionW...
2024-12-126067.46 MB84页172

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