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IC资料

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IC封装资料_电容_CL10A226MO7JZNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10A226MO7JZNC·Product:Multi-layerCeramicCapacitor...
2024-12-1217771.48 MB36页240
IC封装资料_电容_GRM1555C1H8R0DA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12432920.26 KB29页101
IC封装资料_电容_GRM1555C1H8R0CA01D.pdf
GRM1555C1H8R0CA01_(0402,C0G:EIA,8pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121947944.28 KB30页33
IC封装资料_电容_0805B272K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-128021.05 MB27页262
IC封装资料_电容_CL10C300JB8NCNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12762316.27 KB3页113
IC封装资料_电容_CL10C300FB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12585316.18 KB3页126
IC封装资料_电感_SWPA6045S151MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-124671.32 MB22页137
IC封装资料_电源管理芯片_LTC4006EGN-2_PBF.pdf
1LTC40064006faTYPICALAPPLICATIOUAPPLICATIOSUFEATURESDESCRIPTIOU4A,HighEfficiency,StandaloneLi-IonBatteryCharger■CompleteChargerCo...
2024-12-12969333.36 KB20页278
IC封装资料_电容_CL10C272JB8NFNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121240452.9 KB21页97
IC封装资料_电容_C0603C102K3RACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-123071.48 MB25页48
IC封装资料_电源管理芯片_LTC4002ES8-8.4_PBF.pdf
LTC400214002f,LTCandLTareregisteredtrademarksofLinearTechnologyCorporation.Allothertrademarksarethepropertyoftheirrespectiveowners...
2024-12-121447253.54 KB16页80
IC封装资料_电容_C0603C102J5RACTU.pdf
1©KEMETElectronicsCorporation•KEMETTower•OneEastBrowardBoulevardC1002_X7R_SMD•11/8/2018FortLauderdale,FL33301USA•954-766-2800...
2024-12-1217431.48 MB25页194
IC封装资料_电容_CL10A226MP8NUNE.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121296259.57 KB3页268
IC封装资料_电源管理芯片_XL6012.pdf
Datasheet180KHz60V5ASwitchingCurrentBoostDC/DCConverterXL6012Rev1.0www.xlsemi.com1Features�Wide5Vto40VInputVoltageRange�MaximumB...
2024-12-121949526.69 KB14页44
IC封装资料_电容_0805B273K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1214581.26 MB20页24
IC封装资料_电源管理芯片_XL6009.pdf
XL6009400KHz60V4ASwitchingCurrentBoost/Buck-Boost/InvertingDC/DCConverterRev1.1www.xlsemi.com1Features�Wide5Vto32VInputVoltageRan...
2024-12-12718333.44 KB8页88
IC封装资料_电源管理芯片_XL6008.pdf
XL6008400KHz60V3ASwitchingCurrentBoost/Buck-Boost/InvertingDC/DCConverterRev1.2www.xlsemi.com1Features�Wide3.6Vto32VInputVoltageR...
2024-12-12167361.59 KB8页276
IC封装资料_电感_SWPA6045S180MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1213911.32 MB22页162
IC封装资料_电容_GRM1555C1H8R2BA01D.pdf
GRM1555C1H8R2BA01_(0402,C0G:EIA,8.2pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:m...
2024-12-12186944.28 KB30页59
IC封装资料_电源管理芯片_LTC4007EGN_TRPBF.pdf
LTC40071RevDFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONDESCRIPTION4A,HighEfficiency,StandaloneLi-IonBattery...
2024-12-12380338.05 KB24页103

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