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IC资料

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IC封装资料_电容_GRM1555C1H180FA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121007920.26 KB29页98
IC封装资料_电感_SWPA252010S4R7MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1213511.32 MB22页76
IC封装资料_电容_CL10C560KB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12232316.51 KB3页36
IC封装资料_电容_CL10C560JB81PNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12711259.58 KB3页298
IC封装资料_电容_CL10C560JB8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12837316.29 KB3页222
IC封装资料_电源管理芯片_LTC4267IGN-3_TRPBF.pdf
LTC4267-3142673fbFormoreinformationwww.linear.com/LTC4267-3PoweroverEthernetIEEE802.3afPDInterfacewithIntegratedSwitchingRegulator...
2024-12-121171473.89 KB34页237
IC封装资料_电源管理芯片_LTC4267IDHC-3_TRPBF.pdf
LTC4267-3142673fbFormoreinformationwww.linear.com/LTC4267-3PoweroverEthernetIEEE802.3afPDInterfacewithIntegratedSwitchingRegulator...
2024-12-12464473.89 KB34页161
IC封装资料_电容_CL10C560JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12532259.58 KB3页258
IC封装资料_电容_C1005NP0509CGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-1211301.92 MB48页275
IC封装资料_电容_GRM155R61A334KE15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121761920.26 KB29页173
IC封装资料_电阻_YC124-JR-0710KL.pdf
120DATASHEETARRAYCHIPRESISTORSYC/TC5%,1%sizesYC:102/104/122/124/162/164/248/324/158/358TC:122/124/164RoHScompliantProductspecifica...
2024-12-121494868.82 KB12页253
IC封装资料_电容_CL10B102JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121475259.58 KB3页19
IC封装资料_电阻_WA04X220JTL.pdf
ApprovalsheetPage1of9ASC_WA04/06_V15Oct.2010WA04,WA06±±±±1%,±±±±5%,ConvexType&ConcaveTypeGeneralpurposechipresistorsarrayS...
2024-12-121714678.52 KB9页99
IC封装资料_电容_CL10B102JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B102JB8NFNC·Product:Multi-layerCeramicCapacitor...
2024-12-1218251.45 MB36页289
IC封装资料_电阻_VZ067TH1B105.pdf
ProductNameModelNo.ControlNo.DateSalesRepresentativeApprovedApprovedＳＰＥＣＩＦＩＣＡＴＩＯＮHOKURIKUELECTRICINDUSTRYCO.,LTD.Thec...
2024-12-121366248.17 KB13页90
IC封装资料_电容_GRM1555C1H180JA01D.pdf
GRM1555C1H180JA01_(0402,C0G:EIA,18pF,DC50V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm...
2024-12-121031944.29 KB30页203
IC封装资料_电容_GRM1555C1H180GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121422920.26 KB29页257
IC封装资料_电容_0805B473K101CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-126201.26 MB20页156
IC封装资料_电容_CL10C561JB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12437259.58 KB3页74
IC封装资料_电容_CL10C561JB8NFNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-125081.39 MB36页131

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