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IC资料

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IC封装资料_电容_0805B473J500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-126741.05 MB27页145
IC封装资料_电容_C1005X5R1A475K050BC.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[020...
2024-12-1219171.65 MB57页80
IC封装资料_电感_SWPA252010S100MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-1211691.32 MB22页245
IC封装资料_电感_SWPA252010S5R6MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-125021.32 MB22页209
IC封装资料_电容_C1005NP0808BGTS.pdf
3Rev.201710MLCCMLCCMLCCMLCCCONTENT(MLCC)ESTANDARDNUMBER..............................................................................
2024-12-1210611.92 MB48页212
IC封装资料_电源管理芯片_LTC4269CDKD-1_TRPBF.pdf
LTC4269-1142691fc••••33mΩ39k10μF30.9Ω1.21k38.3k100k12k10nF10μF2.2μF0.1μF33pF0.1μF2.2nF1μFtONSYNCPGDLYUVLOPWRGDSENSE–V...
2024-12-121319466.97 KB44页124
IC封装资料_电阻_YC164-FR-074K7L.pdf
120DATASHEETARRAYCHIPRESISTORSYC/TC5%,1%sizesYC:102/104/122/124/162/164/248/324/158T/358L/358TTC:122/124/164RoHScompliantProductSp...
2024-12-12123964.29 KB12页293
IC封装资料_电容_CL10C561JB81PNC.pdf
Supplier:Samsungelectro-mechanicsCL10C561JB81PNCProduct:Multi-layerCeramicCapacitorCAP,560,50V,±5%,C0G,0603AEC-Q200QualifiedA.Dim...
2024-12-127706.16 MB36页264
IC封装资料_电容_GRM155R61A394KE15D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12783920.26 KB29页37
IC封装资料_电容_CL10B102KA8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121276259.58 KB3页188
IC封装资料_电容_0805B473K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1218991.26 MB20页290
IC封装资料_电容_C1005X5R1E105KT000E.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-1211841.61 MB56页74
IC封装资料_连接器_1827868.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1268836.13 MB445页65
IC封装资料_电感_SWPA252010SR47NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-127191.32 MB22页195
IC封装资料_电源管理芯片_LTC4278IDKD_TRPBF.pdf
LTC427814278fc••••12mΩ1µF30.9Ω24k1.8k38.3k100k12k0.1µF33pF0.1µF2.2nF1µFtONSYNCPGDLYUVLOPWRGDSENSE–VCMPSENSE+RCMPVNEGRCL...
2024-12-121504586.8 KB42页168
IC封装资料_电源管理芯片_LTC4274AIUHF-1_PBF.pdf
LTC4274A/LTC4274C14274acfeFormoreinformationwww.linear.com/LTC4274AnLTPoE++PSESwitches/RoutersnLTPoE++PSEMidspansnIEEE802.3atType1...
2024-12-12900414.29 KB30页158
IC封装资料_电容_GRM155R61A473KA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121316920.26 KB29页293
IC封装资料_电容_CL10B102KB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121050259.58 KB3页86
IC封装资料_电容_CL10B102KB8NCNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12145259.58 KB3页200
IC封装资料_电容_0805B473K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-12521.05 MB27页74

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