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IC资料

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IC封装资料_电容_GRM1555C1H240JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-121331920.26 KB29页231
IC封装资料_电容_CL10C681JB8NFNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-12135259.58 KB3页79
IC封装资料_电容_GRM155R61C105KA12D.pdf
GRM155R61C105KA12_(0402,X5R:EIA,1uF,DC16V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12391920.85 KB29页267
IC封装资料_电容_CL10C681JA8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12649316.29 KB3页270
IC封装资料_电容_CL10B102KB85PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121327452.9 KB21页102
IC封装资料_电容_CL10C681FB8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121347259.58 KB3页166
IC封装资料_电容_CL10C680JC8NNNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121592259.58 KB3页80
IC封装资料_电容_0805B561K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1212071.26 MB20页53
IC封装资料_电容_C1608C0G1H682J080AA.pdf
August2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201i...
2024-12-129811.67 MB57页48
IC封装资料_电感_SWPA252012SR68NT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-12631.32 MB22页49
IC封装资料_连接器_1827884.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-1238536.13 MB445页36
IC封装资料_电感_SWPA252012S220MT.pdf
SunlordSpecificationssubjecttochangewithoutnotice.Pleasecheckourwebsiteforlatestinformation.Revised2017/11/18SunlordIndustrialPark...
2024-12-127381.32 MB22页136
IC封装资料_电容_CL10B102KB85PNL.pdf
●Supplier:SamsungElectro-MechanicsCL10B102KB85PNL●Product:Multi-layerCeramicCapacitorCAP,1㎋,50V,±10%,X7R,0603●AEC-Q200Qualifi...
2024-12-1214815.87 MB36页93
IC封装资料_电源管理芯片_LTC4357IDCB_TRPBF.pdf
LTC43574357fdFeaturesapplicationsDescriptionPositiveHighVoltageIdealDiodeControllerTheLTC®4357isapositivehighvoltageidealdiodecon...
2024-12-12181840.98 KB14页121
IC封装资料_电容_0805B561K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-1216751.05 MB27页161
IC封装资料_连接器_1758131.pdf
TableofcontentsDeviceconnectiontechnologyforsignals,data,andpowerfromPhoenixContact2HighdensityPCBterminalblocksandplug-inconnecto...
2024-12-12107836.13 MB445页281
IC封装资料_过流保护_RL16-200.pdf
PositiveThermalCoefficient(PTC)RL16SeriesSpecificationsaresubjecttochangewithoutnotice.Pleaserefertohttp://www.ruilon.com.cnforcur...
2024-12-121419328.49 KB4页74
IC封装资料_过流保护_0451005MRL.pdf
SurfaceMountFuses57©2009Littelfuse,Inc.Specificationsaresubjecttochangewithoutnotice.451/453SeriesNANO2®>VeryFast-Acting>451/453...
2024-12-127341.16 MB4页74
IC封装资料_电容_GRM1555C1H270GA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-1283920.26 KB29页262
IC封装资料_电容_GRM1555C1H270FA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12626920.26 KB29页133

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