拖动LOGO至书签栏，立即收藏五八文库

首页
文档
中小学卷
语文试卷数学试卷英语试卷物理试卷化学试卷政治试卷历史试卷地理试卷生物试卷其他科目
教育资料
电商大学教学幼儿园小学初中高中
技能考试
公务员考试考研考博职业考证学历提升自学考试成人高考校园招聘普通话考试司法考试专业技能证书考试建筑工程考试外贸类考试医学护理类考试财会金融考试导游证考试社会工作者考试人力资源管理师考试心理咨询师考试教师招聘考试教师资格证计算机类考试全国翻译资格水平考试托福考试雅思口语考试专八英语考试专四英语考试大学英语四级大学英语六级公安类结构化面试公安专业国考省考军队文职考试银行招聘考试国考银保监会三支一扶考试事业单位考试公务员遴选公务员考试研究生考试港奥台华侨生联考体育单招考试
模板
安全生产财税公检法合同简历医疗总结汇报其他模板党政范文企业管理毕业答辩方案作文论文标准规范讲话稿
软件
常用软件量产开卡工具实用工具电路图固件施工图 IC资料
文章
问答
专题

添加五八文库到电脑桌面

已经有10万+用户把五八文库添加到电脑桌面，以后点击桌面图标一键打开，无需搜索，非常快捷！

开通会员限时优惠

登录 | 注册

IC资料

分类:

类型:

IC封装资料_电容_CL10C751JB81PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-12971452.9 KB21页295
IC封装资料_电容_CL10C751JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12916316.29 KB3页159
IC封装资料_电容_CL10B102KC8NNND.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:CL10B102KC8NNND·Product:Multi-layerCeramicCapacitor...
2024-12-12495368.85 KB3页178
IC封装资料_电容_CL10C750JB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-12825316.29 KB3页275
IC封装资料_电容_0805B563K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-125611.26 MB20页28
IC封装资料_电容_C1608X5R1E225K080AB.pdf
February2019MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[020...
2024-12-121231.65 MB57页210
IC封装资料_过压保护_PESD5V0S1BL.pdf
PESD5V0S1BLLowcapacitancebidirectionalESDprotectiondiode15May2018Productdatasheet1.GeneraldescriptionVerylowcapacitancebidirection...
2024-12-12112289.56 KB14页206
IC封装资料_过压保护_P0300SCLRP.pdf
SIDACtor®ProtectionThyristors©2017Littelfuse,Inc.Specificationsaresubjecttochangewithoutnotice.Revised:02/23/17BasebandProtectio...
2024-12-121441928.83 KB6页227
IC封装资料_电容_0805B562K500CT.pdf
ApprovalsheetGeneralPurposeCapacitorsPage1of20ASC_GeneralPurpose_001AB_ASDec.2016*Contentsinthissheetaresubjecttochangewithoutprio...
2024-12-1219771.26 MB20页267
IC封装资料_电感_VLCF4020T-2R2N1R7.pdf
INDUCTORSApril2016WoundFerriteVLCF4020InductorsforPowerCircuitsVLCF4020TypeVLCFSeries更多资料下载请到五八文库wk.58sms.com(2/9)INDU...
2024-12-121133195.26 KB9页49
IC封装资料_过压保护_DESD1P0RFW-7.pdf
DESD1P0RFWDocumentnumber:DS35278Rev.5-21of4www.diodes.comSeptember2011©DiodesIncorporatedDESD1P0RFWADVANCEINFORMATIONLOWCAPACITAN...
2024-12-121059173.74 KB5页293
IC封装资料_电容_GRM1555C1H300JA01D.pdf
GRM155R61A105KE01_(0402,X5R:EIA,1uF,DC10V)_:packagingcodeReferenceSheet1.Scope2.MURATAPartNO.System(Ex.)3.Type&Dimensions(Unit:mm)...
2024-12-12752920.26 KB29页284
IC封装资料_电源管理芯片_LTC4359IDCB_TRPBF.pdf
LTC43591Rev.EFormoreinformationwww.analog.comDocumentFeedbackTYPICALAPPLICATIONFEATURESDESCRIPTIONIdealDiodeControllerwithReverseI...
2024-12-1218791.3 MB20页236
IC封装资料_电容_CL10C820GB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121855316.18 KB3页154
IC封装资料_电容_CL10C820FB8NNNC.pdf
SPECIFICATION(Referencesheet)·Supplier:Samsungelectro-mechanics·SamsungP/N:·Product:Multi-layerCeramicCapacitor·Description:CA...
2024-12-121044316.18 KB3页76
IC封装资料_电容_CL10B102KC85PNC.pdf
-MiniatureSize-WideCapacitanceandVoltageRange-Tape&ReelforSurfaceMountAssembly-LowESR-GeneralElectronicCircuitGeneralFeaturesAppli...
2024-12-121810452.9 KB21页185
IC封装资料_电容_C1608X7R1E105KT000N.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-1215151.61 MB56页277
IC封装资料_电容_CL10B102KC8WPNC.pdf
●Supplier:SamsungElectro-MechanicsCL10B103KA8WPNC●Product:Multi-layerCeramicCapacitorCAP,10㎋,25V,±10%,X7R,0603●AEC-Q200Qualif...
2024-12-121161259.58 KB3页155
IC封装资料_电容_C1608X5R1E475KT000E.pdf
MULTILAYERCERAMICCHIPCAPACITORSMULTILAYERCERAMICCHIPCAPACITORSC0402[01005inch]C0603[0201inch]C1005[0402inch]C1608[0603inch]C2012[0...
2024-12-123581.61 MB56页116
IC封装资料_电容_0805B563K500NT.pdf
附件7版本号：FH-2016-001风华高科广东风华高新科技股份有限公司FENGHUAFenghuaAdvancedTechnology(Holding)CO.,LTD一、概述●电容器及介质...
2024-12-125971.05 MB27页249

首页上页 279 280 281 282 283 下页尾页

确认删除?